Research On Simulation Of Oxygen-free Copper Micro-cutting And Influence Of Machining Surface Integrity

Oxygen-free copper has the characteristics of high purity,high electrical conductivity,high thermal conductivity,high corrosion resistance,non-magnetic,low hydrogen permeability,and resistance to oxidation.It has become an important manufacturing material for electronic components and high-precision instrument components.Widely used in aerospace,military,medical and microelectronics.However,in the process of oxygen-free copper,large plastic deformation,easy adhesion,and easy scratches on the surface lead to increased surface defects,which affects the precision and performance of the workpiece,which is a major difficulty in precision micro-cutting of oxygen-free copper.Therefore,it is necessary to study the mechanism and processing technology of oxygen-free copper micro-cutting.This article mainly focuses on the simulation of oxygen-free copper micro-cutting and the influence of surface integrity.First,analyze the material removal mechanism and minimum cutting thickness model during the micro-cutting process.Through the oxygen-free copper micro-cutting simulation,analyze the material flow,stress and strain and the minimum cutting thickness during the oxygen-free copper micro-cutting process.The minimum cutting thickness of h/r is between 0.1 and 0.2,and the change of h/r causes the cutting method to change.Secondly,orthogonal micro-cutting simulation and experiments were performed on oxygen-free copper,and the effects of different cutting parameters on cutting force,cutting heat and residual stress were analyzed,and experimental verification was performed.Then,a single-factor test of microgroove milling for oxygen-free copper was carried out to study the influence of different processing parameters on the evaluation indexes of surface integrity such as surface roughness,texture,residual stress,and microhardness.The influence of chip morphology,analysis of the processing mechanism and reasons,to obtain reasonable processing parameters to reduce surface defects and improve surface quality.Finally,the micro-groove milling process optimization test was carried out on oxygen-free copper,and the surface roughness,residual stress and micro hardness were used as evaluation indexes.The micro-cutting optimization test was carried out.The optimal processing technology parameters and significant verification were carried out.The results show that the order of the effects of processing parameters on surface roughness is as follows: feed per tooth,spindle speed,cutting thickness;The order of the impact on micro hardness from the largest to the smallest is spindle speed,cutting thickness,feed per tooth;The order of impact of machining parameters on residual stress is feed per tooth,spindle speed,cutting thickness.In order to verify the rationality of the process optimization,the typical small parts are designed and the process verification tests are performed.The results show that the optimized process can meet the design requirements and can significantly improve the processing quality.