Preparation And Application Of Rubber Bond Lapping Disc

With the development of electronic information technology and biomedical technology,hard and brittle materials have been used more and more widely because of their good mechanical and physical properties,and their processing requirements have become higher and higher.Currently,free abrasive and fixed abrasive lapping technologies still have large surface damage for hard-brittle sheet parts after processing.Therefore,the development of a high-efficiency,low-damage lapping processing method is of great significance to improve the processing quality and reduce production costs,and to promote its application in various fields.This paper presents a flexible rubber bond lapping disc for lapping hard-brittle sheet parts,and studies the preparation method,lapping effect,and lapping mechanism of the lapping disc.The main contents of this article include:(1)A flexible rubber bond lapping disc is proposed for the lapping of lapping hardbrittle sheet parts.Abrasive particles with a large exposed height on the surface of the lapping tool can be compressed into the elastic bonding agent,and the scratches on the surface of the workpiece to be ground are shallow,which ensure that the surface of the workpiece has a lower surface roughness and less surface damage.(2)The preparation technology of the abrasives was studied,and rubber lapping blocks with different dosages,concentration of abrasive,and abrasive sizes were prepared.The distance between the abrasive,the density of the abrasive,the hardness and elastic modulus of the rubber blocks were measured.Then,the sapphire single-side lapping experiment was carried out with different formulas of lapping discs.According to the lapping results,the optimized formula of the rubber bond lapping tool was determined: the compounding agent was used as the formula 1,the concentration of abrasive was 200%,and the abrasive size was 230/270.(3)A rubber bond double-sided lapping disc was prepared using an optimized formula.The double-side lapping disc was trimmed with an Al2O3 lapping wheel and an Al2O3 trimming sheet,and then a sapphire double-side lapping experiment was carried out.Evaluate.The results show that after lapping the sapphire using a rubber bond lapping disc,it can achieve a good surface quality.After lapping,the surface roughness of the wafer can reach about 172 nm,the material removal rate can reach about 713 nm/min.The disc can be well applied to the lapping process of hard and brittle materials.(4)The rubber bond uses the Mooney-Rivlin strain energy density function model to simulate the movement of abrasive particles under lapping pressure.Simplify the lapping process,group the abrasive according to the exposing height distribution of the abrasive,and study the effective number of abrasive in the lapping process.Based on the contact model of the abrasive and the workpiece,and the principle of force balance,study the depth of the sinking of the abrasive in the bond and the depth of cutting into workpiece,then compared with the simulation results.Based on the definition of the arithmetical mean deviation of the profile Ra,the surface roughness theoretical model and material removal rate model were established.Comparing the predicted value of the model with the experimental value of single-sided lapping,it is found that the trend is consistent,which proves the reliability of the model.