Research On Glass Phase Modification Andproperties Of SiC/Cu Composite Materials

The application prospect of SiC/Cu composites is very broad.It has good mechanical properties,thermal and electrical conductivity,and It also has a simple preparation process and low production cost.It is a typical"structure-function integration"materials and It often used as electrical contact materials and electronic packaging materials in semiconductor components.At present,the poor interfacial wettability and interfacial reaction between the enhanced phase SiC and Cu matrix had limited the performance improvement and application of SiC/Cu composites.Therefore,the key to improve the overall performance of SiC/Cu composites was to improve the interfacial wettability of SiC and Cu and the interfacial reaction was controlled.In this study,industrially produced micron-scale?-SiC particles were used.The92SiO₂-8Cu₂O?wt.%?Glass phase was introduced to improve the interfacial wettability of the enhanced phase SiC and Cu matrix and improve the SiC/Cu composite by controlled the interfacial reaction.The SiC/GP/Cu composite powder was prepared by sol-gel and wet ball milling methods,and the SiC/Cu composite with uniform structure and compactness was prepared by hot pressing sintering process.XRD,SEM and other detection methods were used to characterize the phase composition,microstructure,density,and flexural strength of the samples,and the effects of sintering temperature and glass phase content on the electrical properties of SiC/Cu composites.Research indicates:The introduction of the copper-silicon oxide glass phase effectively improved the interfacial wettability between the two phases of SiC and Cu,and It controlled the interfacial reaction between the two phases to a certain extent,and the overall performance of the composite material was improved.Under the same sintering temperature,the density and flexural strength of SiC/Cu composites gradually increased with the increase of the glass phase content of the sample.The density increased with the increase of the sintering temperature,and the bending strength of the sample generally increased with the increase of the sintering temperature,but the bending strength of the sample decreased when the sintering temperature was 800?.When the glass phase content of the SiC/Cu composite was 9 wt.%and the sintered temperature was 900?,its comprehensive properties reach the optimal value,the relative density was 99.81%,the bending strength was 470 MPa,and the hardness was 1.85 GPa.The high-temperature resistivity of SiC/Cu composites was not greatly affected by the sintering temperature,but the glass phase content in the sample directly affects the resistivity change law.The resistivity of the composite material increased slowly with the increase of the test temperature at room temperature to about 400?,and it shown the conductivity characteristics of metallic copper.The resistivity of the composite material decreases and the resistivity changes at 400°C to 550°C.The valleys appear in the curve,and then increase exponentially immediately,and the higher the glass phase content in the composite,the higher the initial temperature of the valleys;the temperature was around 550?to 650?,and the resistivity of the samplewas at a constant value.It fluctuates up and down,shown a constant trend,and this phenomenon has nothing to do with the composition and sintered temperature of the composite material.