Preparation And Properties Of TiN And TiAIN Thin Films By Reactive Magnetron Sputtering

In this paper,we adopt pure titanium and pure zirconium as target materials,Titanium aluminum nitride(TiAIN)thin films and TiN films were deposited on glass and 9SiCr steel by reaction magnetron sputtering.And by changing the process parameters such as nitrogen partial pressure,reaction pressure,the Sputter power and substrate bias,their microstructure,color change,composition,and change of growth orientation under various parameters were explored.were studied the effects of process parameters on the surface morphology,hydrophobicity,wear resistance and corrosion resistance of TiAIN films,by changing the reaction pressure,the substrate temperature and the Al target power.X-Ray Diffraction(XRD),Scanning Electron Microscope(SEM),contact angle measurement,Micro-hardness measurements were used to observe and analyse the microsctrcture,Micromorphology and Properties of the films.Results are as follows:(1)TiN films is Fcc structure and show the(111)orientation,changing process parameters can not alter its sctrcture but can later the preferred orientation.Changing the process parameters significantly affected the microstructure of TiN film.With the increase of bias voltage,grains are refining.TiAIN films is Fcc structure and show the(111)preferred orientation changing process parameters can not alter the preferred orientation.(2)The reaction pressure has the greatest influence on the morphology of the film,and with the increase of the reaction pressure,the film changes from the island growth to the layered growth.The increase of substrate temperature increases the density of the film,reduces the defects and increases the grain size.The increase of the target power of Al in the range of 50W-150W is beneficial to grain refinement and lower surface roughness.(3)With the increase of the temperature and reaction pressure,the contact angle decreases.The TiAIN films prepared by the reaction pressure of 0.2Pa and 0.4Pa showed hydrophobicity,and the other samples were hydrophilic.(4)The highest hardness of the TiAIN film prepared is 2178HV,The hardness of the film decreases with the increase of the reaction pressure.The increase of Al the target power makes the hardness increase and the substrate temperature has little effect on the hardness.(5)The 2#sample has the best wear resistance and corrosion resistance,the process parameters:reaction pressure is 0.4Pa,the substrate temperature is 100℃,and the Al target power is 100W.