The Structural Design And Process Parameters Analysis Of Cutting Tools Embedded With Force-measuring Thin Film Sensor

With the rapid development of MEMS technology,intelligence and miniaturization have become the major development trend of today's Era.More and more products are developing in the direction of intelligence.Because of the limitations of traditional dynamometer,it can not meet the needs of modern machining for cutting force measurement.In order to realize real-time monitoring and measurement of cutting force,this paper designed a thin film embedded tool structure,and analyzed the preparation process parameters of its thin films.This paper proposed an optimization method of embedded tool structure.By studying the working principle of the tool under force and the mechanism of resistance strain sensor,and combining with the theory of material mechanics,the necessary relationship between the output voltage and the cross section moment of inertia of the tool is obtained.On the whole,three groove structures,rectangular,triangular and elliptical,are designed for the cross section of the tool handle.Then,according to the strength requirement of the cutting tool,the rectangular and elliptical structures are further optimized and calculated in a reasonable range,and the maps of seven shapes on the basis of the rectangular and elliptical shapes are obtained.By comparison and analysis,the third-order rectangular groove tool structure model which can output large voltage and meet the strength requirements is finally obtained.Finally,the seven structures are simulated and analyzed by three-dimensional modeling and finite element analysis,and the rationality of the structural design is confirmed by the data analysis and comparison.The elastic substrate is a key part of the film preparation process.The surface quality of the substrate directly affects the quality of the film.Therefore,the polishing process of the elastic substrate is deeply studied,and a stainless steel substrate with a surface roughness of less than 0.2 ?m is obtained.Then,the process and technology of the preparation of the thin film insulating layer are discussed,and the thin film insulating layer is prepared on the elastic substrate.Four influencing factors of deposition rate and surface roughness during film preparation were studied by orthogonal test method.The influence of four influencing factors on the deposition rate and surface roughness was obtained by range analysis.Two empirical formulas for quality characteristics of the deposition parameters are fitted with experimental data.Through the analysis of the index,the influence degree of each factor is obtained,and then the test data are analyzed by using MATLAB.Finally,the experimental results,empirical formulas and analysis results are compared,and a better combination of film deposition parameters is obtained.The final results show that when the sputtering power is 100 W,the working pressure is 1Pa,the gas flow ratio is 0.1,and the substrate temperature is 200?,the deposition rate of the films is between 10nm/min and 15nm/min,and the surface roughness of the films is between 50 nm and 55 nm.Meanwhile,a faster deposition rate and a lower surface roughness can be obtained simultaneously.