Characteristic Of Bounded Abrasive Polishing For Fused Silica Glass In Anhydrous Environment

At present,for example,civil optics,semiconductor,optical communication,large laser fusion device,astronomical telescope and other scientific and industrial fields,the demand for high-precision optical components is increasing.Fused quartz has low thermal expansion coefficient and high thermal inertia,and is widely used in the manufacture of Windows and shielding plates due to its good physical and chemical properties.Traditional fused quartz processing route is mainly "precision/ultra-precision grinding+deterministic CNC polishing",in the deterministic CNC polishing stage is currently the main use of free abrasive polishing technology,mainly composed of three factors:polishing fluid,polishing pad,workpiece.Free abrasive polishing can obtain extremely high surface quality(Ra<1nm),and few optical components with subsurface defects.However,because the processing environment is water or solution environment,there will be a few nm to several hundred nm hydrate layer on the surface of the polished workpiece,and new procedures need to be added to remove,thus increasing the process cost.Free polishing abrasive particle in the process of the utilization rate of less than 0.5%,causing a large amount of waste and so on many problems,aiming at these shortcomings,this paper proposes a abrasive consolidation into polishing wheel and in the absence of water environment of fused quartz processing method,the method can within 20 min would reduce the roughness of the fused quartz from 200 nm to 10 nm below,will eventually get roughness Ra is less than 2 nm,removaling efficiency can reach 4,2 um/h index slightly higher than the free abrasive polishing technology(4 um/h),surface without hydration layer surface of the high quality.The main research contents of this paper are as follows:(1)The preparation process route of the polishing wheel was determined,and the optimal composition ratio of the polishing wheel was determined through the comparative processing experiment.According to the experimental results,the role of each component in the actual processing process was fully elaborated.(2)The influences of pressure and rotation speed on removal efficiency and surface quality were clarified,and the optimal processing parameters of the technology were given in the waterless environment.Explore the polishing principle of this kind of processing method through chemical means;Spot puncturing experiment was carried out,which provided a certain theoretical basis for the application of this technology in COOS.(3)Fourier law of thermal conductivity was used to analyze the processing temperature in the polishing process,and the temperature thermal conductivity model of the polishing wheel and the glass workpiece was established.The actual processing temperature range measured by the experiment was between 28 ? and 80 ?,and the reason why the removal efficiency did not follow Preston formula was preliminarily explained.(4)The whole surface processing test of fused quartz was carried out by using this technology,and the program process of "magnetic polishing process + quantitative polishing detection" was designed to obtain the subsurface depth of consolidated abrasive polishing technology.