| In the electronics and information industries,when designing circuits or manufacturing electronic devices,in order to block external interference signals,various signal shielding technologies are usually used.Among them,the short-circuit ring technology is more commonly used,which is a relatively popular technology for shielding external signal interference.Short-circuit ring technology can significantly reduce inductance and electromagnetic flux.In the TFT LCD industry,this technology is usually used in LCD screens,the purpose of which is to block the influence of external interference on the LCD circuit wiring.Before entering the module process and bonding the IC device,the LCD screen must be cut off from the short-circuit ring connection of the internal circuit of the panel.Otherwise,the circuit will be connected in series after the module bonding IC device,thus making the circuit of the LCD screen short-circuited.Therefore,the quality of the short-circuit ring cutting will seriously affect the subsequent production process of the liquid crystal.In the TFT LCD industry,the most widely used short-circuit ring cutting method is laser cutting.Through the analysis of theory and production data,we can find out the factors affecting the quality of laser cutting.In actual production applications,we can focus on improving the impact factor to improve the laser cutting quality of short-circuit ring.This paper mainly studies the short-circuit ring cutting system in the TFT LCD process.During the research process,the problems of missed cutting,incomplete cutting and cutting path offset in the short-circuit ring cutting in the TFT LCD process are statistically analyzed and analyzed.According to the analysis results,the causes of the problems are obtained,such as laser selection error,residual effect of short-circuit ring foreign matter,laser head out of focus and deviation of laser head theory from actual light-emitting point.In this paper,the best detection width is verified by the single factor and other test methods.At the same time,after in-depth research and testing,a series of improved methods for the actual production of short-circuit ring cutting are proposed,including the selection of the corresponding laser according to the material of the metal circuit,increasing the foreign object interception logic of the detection system,limiting the adjustment range of the laser head and increasing the external device to overcome the amount of the bending of the panel,and designing a new fixture to improve the stability of the laser head in high-speed movement.Finally,the improved results can be used in actual production to reduce the incidence of abnormal cleavage abnormalities from 0.035% to 0.001%.On this basis,by designing a new type of laser cutting system,the terminal short-circuit ring laser cutting system is further optimized.The new laser cutting system adds a high-rate detection CCD and a retractable foreign body cleaning mechanism to the original laser cutting system.The low magnification is combined with the high magnification CCD to intercept the abnormality of the short circuit ring cutting.Among them,the low-magnification CCD detects the overall cutting pattern of the short-circuit ring,and the high-magnification CCD detects the detailed cutting pattern of the short-circuit ring.The new system automatically identifies the cutting quality of the short-circuit ring through the gray-scale difference,reduces the leakage of the cutting abnormality,and realizes the automation and intelligence of the short-circuit ring laser cutting system,and effectively improve the cutting quality,greatly reducing the rate of personnel reconsideration,can be reduced from 1% to 0.001%,which can help enterprises avoid the cost loss caused by the short-cut ring cutting,improve the automation of equipment operation and enhance the competitiveness of enterprises.At the same time,it contributes to the industry 4.0 for the TFT LCD short-circuit ring laser cutting process. |
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