Preparation And Performance Of Graphene-based Thermal Insulation Silicone Rubber

Thermal insulation materials are widely used in electronic encapsulation adhesive,heat dissipation and insulation is the key to guarantee the normal work of the electronic devices,polymer with thermal insulation filler is the common preparation method of electronic packaging adhesive.Conventional inorganic thermal insulation filler has a range of 30%-150%wt,and the high proportion of added weight has affected other properties of the polymer,such as mechanical properties.This topic using graphene surface load thermal insulating particles?silica,boron nitride,zinc oxide?composite material as a filler,and room temperature vulcanized silicone rubber molding as polymer matrix,in the case of low content preparation of thermal insulation silicone rubber was studied.First,graphene?RGO?was successfully prepared by REDOX method and the modification of graphene grafted by vinyltriethoxysilane?FRGO?.RGO as the substrate material of graphene composite packing;Using FRGO hydrophobic characteristics and disperse better in ethanol,while graphene composite filler mixed with silicon oil,using silane modified can not only increase the filler dispersion,and vinyl access filler surface can participate in silicone rubber vulcanization silicon hydrogen addition reaction,improve the interfacial reaction between the fillers and matrix.With sol gel method,solvent hot method,precursor high temperature reaction of silica/graphene?SiO₂/RGO?,ZnO/graphene?ZnO/RGO?,boron nitride/graphene?BN/RGO?composite materials.The relevant characterization means that the surface loads of SiO₂/RGO are silica particles and a small number of amorphous silica structures.ZnO/RGO surface load is zinc oxide of hexagonal structure.The main load of BN/RGO surface is boron nitride.The three kinds of graphene-based compound fillers were prepared by using silane modified with silicone rubber,and the thermal insulation composite silicone rubber was obtained 1.0 wt%content of SiO₂/RGO,ZnO/RGO,BN/RGO composite silicone rubber,thermal conductivity,respectively,increase of 75.0%,80.5%,58.8%,volume resistivity were 9.3 x 10¹³?·cm,1.1 x 10¹⁴?·cm,6.0 x 10¹¹?·cm,excellent thermal insulation performance.And with the increase of filler,the thermal expansion coefficient of composite silicone rubber declined,heat-resisting performance improved,keep in relatively low dielectric constant and dielectric loss,in the field of electronic packaging material,has excellent thermal and electrical performance.Content of 1.0 wt%,the tensile strength of the composite silicone rubber average rose 125.6%,the elongation at break average rose 123.8%,shore hardness average rose 24.4%,mechanical properties without drops because of the incorporation of filler but a certain degree of improvement.Compared with the silicone rubber which needs high content of traditional thermal insulation filler,the mechanical properties of silicone rubber are improved simultaneously with the thermal insulation performance of the silicone rubber.