The Preparation Process Of Heat-resistant 3D Printing Resin

In the “13th Five-Year” medium and long-term development plan released by China in 2015,it clearly puts emphasis on and accelerates the development of 3D printing technology;At present,although some units of our country have already done a lot of work in the development of 3D printing raw materials,the development of 3D printing equipment and the application of 3D printing technology and some of the technologies are already at the leading level in the world,However,compared with developed countries,there is still a large gap between China in researching the breadth and depth of 3D printing and independently developing high-performance photosensitive resins.The equipment for the photo-curing rapid prototyping system is mainly for the operation of resin-based liquids,Therefore,in the process of photocuring,the photosensitive resin will produce volume shrinkage,which will cause the warpage of the model,etc.The strength,heat resistance and rigidity of the printed parts are very limited,which is very unfavorable for long-term preservation of the products,With the rapid expansion of the application of 3D printing technology,a single color can no longer meet the needs of market development,Product appearance has become an important factor to attract people’s desire to purchase.Full color will certainly replace monochrome and become the protagonist of this era.Therefore,we must put forward higher requirements for product stability,heat resistance and safety.In China,there are very few studies on 3D printing of heat-resistant resins.Therefore,it is particularly important to develop environmentally friendly,low-cost,general-purpose,high-strength and heat-resistant color photosensitive resins,which are mainly used in the transportation,construction and mining industries.This article prepared a high-temperature,low cure shrinkage and multi-color photosensitive resin.First,the oligomer urethane-modified epoxy acrylic resin was synthesized,The synthesis step is to synthesize polyurethane modified epoxy acrylate resin using F-51 epoxy resin,acrylic acid,SC-A and SC-B as raw materials.The structure of the target product is then characterized.The oligomers,glass fibers,reactive diluents,and photoinitiators are mixed to prepare a photosensitive resin and then the orthogonality test is used to analyze the variance and badness and the heat resistance and the curing shrinkage are combined with the content of each component in the resin formulation.Make a choice,The optimum level of resin formulation is: A2B2C3D1,Trimethylolpropane triacrylate 3.5 g,Polyurethane Modified F-51 Epoxy Acrylic Resin 2.5 g,Dipropylene glycol diacrylate 1.5 g,SC-C 0.5 g.Determine the degree of influence of each factor on the cure shrinkage of the resin.The order of magnitude is: C>A>D>B,Dipropylene glycol diacrylate > Trimethylolpropane triacrylate>SC-C>Polyurethane Modified F-51 Epoxy Acrylic Resin,Based on the above-mentioned optimal level formula,Add dye to it,Determine the optimal amount of dye added,Finally,the amount of photoinitiator was determined.The heat resistance and mechanical properties of the photosensitive resin after curing are tested,Its stability temperature reaches 417.59 °C,Compared with ordinary heat-resistant resin,the temperature is increased by 40 °C;After heat-resistant photosensitive resin curing volume shrinkage rate of 1.32%;Its tensile strength reaches 35.951 MPa,The compressive strength reaches7.323 MPa and the bending strength is 50.178 MPa;Compared to the sample Formlabs photosensitive resin,the proportions were 73.89%,53.58% and 109.27%,At the same time,we print out models of various colors.