Numerical Simulation Of Inductively Coupled Helium Discharge

The application of low temperature plasma,over the past 30 years,from the main lighting microelectronics equipment to the new material is far more than we expected.Rf plasma,which from 10~5 Hz to 10~9 Hz,is now for processing metal,semiconductor and insulating materials of super large integrated circuits(ULSI)storage of various functional thin film and modify the surface properties especially.Its development is not balanced,however,the ionized gas is more complex a lot than plasma systems,there are still many physical mechanism not yet thoroughly mastered.Especially in industrial applications,most of the process mechanism of the image is not clear,complete,and affected by the factors such as processing technology,process complex.That causes process repeatability is poor for the lacK of effective monitoring and adjusting methods,unstable product quality,low efficiency of the status quo.The basic research of the low temperature plasma is particularly important.Experimental research under a lot of difficulties in the basic research,with the rapid development of computer,numerical calculation and simulation study more and more important.In this paper the study of low temperature plasma discharge mainly do the following several aspects:1.Contrast reaction gas discharge coil used in the effects on the discharge effect,with helium and argon as standard reaction gas compared three different coil material on the result of discharge.After comprehensive comparison,that found,coil material effect on the induced plasma is not obviously,so research usually use the Cu coil.2.Two-dimensional fluid dynamics model is established using Comsol software,simulated the helium inductive coupling plasma discharge process,and draw the ion energy distribution function.More simple than argon helium discharge process,the use of helium gas discharge plasma discharge details.3.This paper studies the external parameters such as the source power,discharge pressure and discharge temperature plasma put on characteristics,the influence of electron number density,the density of helium atoms are given respectively,the coil resistance and power,the electric potential distribution and electric field simulation of two-dimensional picture of mold.The discharge power increasing from 1000 W-3000 W,electron number density,electron temperature and the electric potential distribution are increased;When the pressure increased from 0.02 torr-0.16 torr multiples,the electron number density and electron temperature is increasing,and the electric potential distribution trend is more complicated;When the temperature from 300 K to 1200 K,the number of electronic,temperature and electric potential all showed a trend of decrease,discharge power for helium put between 1000 W-3000 W.4.The same as compared with argon discharge conditions,two completely different change trend,found that as the number of electrons in an argon discharge pressure increases,but the temperature and the electric potential are decreased Number of electrons in an argon discharge and potential are sharp decrease with temperature.The present studys the argon discharge,compared with argon discharge process comprehensively.On basis,puts forward mixed gas discharge,through the proportion of the two gases mixed in order to achieve higher discharge performance.