Multi-layered Bandpass Filter Design

With the rapid development of communications and electronics,electronic devices with miniaturization,low cost and high performance is becoming a hot spot in research.Especially in the RF transceiver system,filter is an indispensable link,the miniaturization of high performance filter has become a new design direction.The traditional process cannot both improve the performance and reduce the size of the filter,and the continuous development of LTCC technology makes it possible.The paper adopts LTCC technology to design the six order bandpass filter using the structure of stepped impedance resonators to achieve flexible design,realizes the design of S waveband bandpass filter with high performance and high suppression,the overall size is only 6.8mm*4.2mm*1.5mm.Filter,as the essential equipment of THz electronic devices,is of great significance for research and design.The paper adopts the substrate integrated waveguide structure in the design of THz bandpass filter,using TSV technology to make through holes.Which guarantees aperture accuracy of the hole and suppress the drift of center frequency of THz filter,combined with 3D stacked technology of integrated circuit,three-dimensional stack of substrate integrated waveguide resonator meets the demand of the miniaturization of filters.