| The preparation and properties of novel hydroxyapatite nanorods and chitosan composites were investigated in this paper.Hydroxyapatite nanorods was successfully synthesized via a novel THF induced and stabilized route with Ca(NO3)2,H3PO4,and NaOH.THF as the sole functional organic molecule and a new reflux-solvothermal method was used in this study.The structure,morphology,properties and related mechanisms of the hydroxyapatite nanorods and their composites were investigated.The preparation method,the effect of templat and the types of template on hydroxyapatite nanorods were investigated in the preparation of novel hydroxyapatite nanorods.The hydroxyapatite nanorods/chitosan composites were prepared by mixing the prepared hydroxyapatite nanorods with chitosan.The morphology,structure,properties and related mechanism of the composites were also studied.In the process of experiment,the XRD,FE-SEM,FTIR and TG were used to characterize the composites.The factors affecting the adsorption of Cu2+ on the composite were investigated from the aspects of the ratio of hydroxyapatite nanorods,the adsorption time of the composites and the structure of nano-hydroxyapatite.The results proved that hydroxyapatite nanorods synthesized by the reflux-solvothermal method are well crystallized and the nanopits in the surface were also confirmed.HA/CS composites were homogeneous.With the increasement of nano-hydroxyapatite,the pores in the composites were decreased while the thermal stability of the composites was improved.In the experiment,nano-hydroxyapatite prepared by refluxing-solvothernal method has better adsorption performance than hydroxyapatite prepared by reflux method.The optimal adsorption conditions were as follows:the addition ratio of hydroxyapatite nanorods was 30%in the composite and the adsorption time was 5 hours.The adsorption capacity was 116.350 mg/g for 5 hours,and the maximum adsorption capacity was 147.880 mg/g for 24 hours.The adsorption of Cu2+ by hydroxyapatite involves surface adsorption and ion exchange. |
