Research On Monitoring Methods And Monitoring System Realization For IC Packaging Process

The IC packaging process is a vital process in the IC manufacturing industry.The quality of the package directly affects the reliability and service life of the finished chip,which in turn limits the overall performance of the electronic product.In order to monitor the status of the process in real time in the production process,to ensure the quality of the chip package,timely and accurate process monitoring is essential.However,China's IC manufacturing industry is still in its infancy,with a large gap between developed countries and domestic research on packaging process monitoring lags behind,the corresponding monitoring platform is also relatively lacking.This article starts with the process characteristics of the packaging process,proposed a phase division strategy for multiphase batch process monitoring of packaging process and a chip flash inspection method.Finally,we integrate the above methods to design and develop the corresponding monitoring software platform.The software enables reliable monitoring of the IC packaging process.The specific research work of this paper is as follows:1.Aiming at the requirement of software platform for the monitoring,quality prediction and inspection of IC packaging process,a systematic platform integrating data acquisition,process monitoring and fault diagnosis,quality prediction and inspection is designed and developed.On the one hand,the platform solves the actual demand for the above functions;on the other hand,it also provides strong support for the verification of subsequent theoretical algorithms.This system not only has the local operation function,but also takes the needs of remote monitoring into consideration,laying the foundation for the follow-up distributed big data monitoring system.2.Aiming at the problem that the single monitoring model of integrated circuit packaging process is not sensitive to faults,mining its inherent multi-period features through data-driven analysis.The necessity of multi-phase analysis and modeling is verified.Furthermore,a phase division strategy for multiphase batch process monitoring base on particle swarm optimization and process-related characteristics is proposed.The algorithm overcomes the problem that the algorithm needs man-made selection of key parameters.3.Aiming at the high-quality requirements for the IC packaging process,the causes and solutions of the main quality problems in the IC packaging process are analyzed.The most concerned quality problem,the packaging flash,is focused on.A method of automatic inspection and calculation of IC packaging flaw based on image processing is proposed,which realizes the quantitative measurement of the packaging flash.