Simulation Of Stress And Strain Of PEO-LiX And Al Anode Based On Abaqus

Micro-electromechanical systems(MEMS)was derived from the appearace of development of micro-manufacturing technology which also opened up the emergence of a new industry and field.MEMS packaging technology is not only one of the most important task,but also one of the most influential factors decides MEMS striding forward to international market and widely used.Anodic bonding technology which is one of the key technologies for MEMS devices,has been widely used in many fields.A variety of functional materials such as glass and silicon,ceramics and metal were achived by Anodic bonding.The polymer solid electrolyte which overcomes poor impact resistance of glass and ceramic,has the advantages of corrosion resistance,compactness,light weight,good plasticity and so on so it has a great prospect in anodic bonding technologyIn order to promote the anodic bonding technology in the use of mems encapsulation link,develop aion conductive polymer instead of the original packaging bonding material.Design using polyethylene oxide(PEO)as matrix,alkali metal lithium(LiClO4?LiPF6?LiBF4)as the electrolyte material,using the method of high-energy ball mill for grinding material blending,fully complexation,and analyzes the changes of conductivity under different processing parameters.Finally using the PEO and LiCl O4 according to the mass ratio of 10:1,the ball mill speed of 250 r/min,ball grinding time of 8 hours,the ball material ratio of 7:1,conductivity best.To the preparation of PEO-LiClO4 anodic bonding with aluminum foil,the bonding parameters as: preheat to 100?,the preset voltage 800 v,10 min under the conditions of bonding time,bonding quality is good,have excessive layer,which is to bond the key to success.Specifies that the preparation of ionic conductive polymer PEO-LiClO4 satisfies the requirement of anodic bondingFinite element analysis software Abaqus to polymer solid electrolyte and aluminum single bond,on the basis of analysis and research generated in the cooling process after anodic bonding of residual stress and deformation,thus known bonding deformation from the surface to the lower surface of the specimens increases gradually,the more far away from the center of its deformation,the greater the;Bonding specimens of equivalent stress on the transition layer is the largest,and the transition from the middle to the polymer solid electrolyte layer and the aluminum layer decreases sharply.Again to the transition of different thickness,bonding structure,cooling time,bonding temperature,initial temperature(cooling)by numerical simulation of the bonding specimen by data analysis software Origin to get the maximum deformation and maximum stress value of group comparison and the limited data of the mathematical modeling and curve fitting,the function is derived.Finally be bonding specimen deformation as the bonding specimen between excessive layer,the increasing of bonding temperature,specimen bonding interface stress with the decrease of the bonding specimen excessive middle layer thickness,bonding temperature increases.According to the change rule can be appropriately control the thickness of transition layer,bonding temperature,bonding structure control bonding stress and strain of the specimens in a suitable range,so as to achieve lower bonding specimen internal residual stress and strain,to improve their performance...