| According to Moore’s Law,integration of IC will be doubled every 18 to 24 months,the ability of cooling device will be increased.And then the internal device thermal expansion efficiency and external cooling rate are of more requirements.In the field of power electronics is of the same circumstances.Most of the application of the IGBT module of the converter valve are of water cooling.The cooling technology of water cooling system is mature and has many advantages.However,with the improvement of power dissipation of power electronic devices,the traditional water cooling system will be unable to meet the demand of power electronic devices.In this paper,liquid metal is applied to heat dissipation of power electronic devices,and the application of liquid metal cooling technology in power electronics field is studied from many aspects,such as working fluid,theory,cold plate and cooling system.As the application of liquid metal technology is not mature enough,its application in the field of power electronics,there are still many problems on the research rarely reported in the paper.In this paper,the thermal expansion of liquid metal in cooling system of power electronic device is proposed creatively.Ansys Fluent software is used to simulate and analyze the heat dissipation system and to analyze the heat dissipation performance of local components for different cold plate models.The feasibility of liquid metal cooling technology applied to heat dissipation of high power power electronic devices is verified to some extent,and the heat dissipation effect is evaluated.Specific work is as follows:1.IGBT cooling technology and liquid metal research and application of the level of research.2.The theoretical analysis and calculation of the application of liquid metal heat dissipation technology,and the theoretical analysis of its application in power electronic devices may be encountered.3.For the existing traditional water cooling system model,using numerical simulation analysis technology to replace its thermal refrigerant were deionized water and liquid metal,comparative analysis of its cooling effect,select the best for the system cooling Performance improvement provides a reference.4.Aiming at the cold plate model,a variety of improved models are proposed,and the thermal performance of the liquid metal is improved by simulation analysis,which provides a reference for the cold plate model design of liquid metal. |
