The Preparation Of Copper Conductive Ink And Performance Research

Conductive ink is a key technology of modern electronic manufacturing industry,which has been widely used in many electronic products.In recent years,the preparation and properties have been focused with the booming development of electronic industry.The studies of conductive fillers focus on the substitution of Ag powder by Cu powder for the reducing cost.The easy oxidation and high cost of nano Cu powder as the key conductive fillers have not resolved effectively.The study has been presented for the decrease of cost and simplified production procedure.The copper conductive inks have been prepared using the micron copper powder by ball milling as the filler and phenolic resin as the adhesive to resolve the easy oxidation,easy agglomeration and high cost of nano Cu powder.The Cu films have been prepared on the polyimide film by the silk screen printing.The effects of copper powder,coupling agent and film-forming agent on the microstructure and properties have been characterized by X-ray diffraction(XRD),scanning electron microscope(SEM),optical microscope(OM),and four point probe resistance tester,respectively.The printed copper films presented the good performance on electric conductivity,stable performance,reliable performance,adhesion,etc..The main contents of this paper are as follows:1?The addition of milled Cu powder and the effects of contents on properties Cu ink have been determined.The results show that the copper ink with 70% copper content presents the good performance that the lowest resistivity reaches 53.865m?·cm.2? The influence of coupling agent on preparation of copper conductive ink was studied and the adding method and contents were determined.The results showed that the Cu ink presented the good performances by the direct addition of the mixture of silane coupling agent and titanate coupling agent.When the content of silane coupling agent is0.8% of copper powder and the titanate coupling agent is 1%,the resistivity of conductive copper film reached 27.56 m?·cm.3?The influence of film-forming agents on Cu conductive ink has been studied.The resistivities have no significant difference for addition of tetraethoxysilane,ethocel and dimethyl phthalate film-forming agents.However,the surface finish reached 8~7 grade forthe addition of dimethyl phthalate.4?The effects of particle size of the conductive fillers on the performance of copper conductive ink have been studied.The Cu conductive inks have been prepared using the mixture of milled Cu powder and 8 ?m copper powder as the conductive fillers.When the ratio of milled Cu powder to 8 ?m copper powder was 17:3,the Cu film showed the best conductivity,that the resistivity is 18.11m?·cm.5?A prodcudure of preparation of Cu conductive ink has been presented using milled Cu powder as the conductive fillers and the phenolic resin as the adhesive,respectively.Results show that when the mass ratio of milled Cu powder and phenolic resin was 7:3 and the appropriate coupling agent and film-forming agent have been added,the Cu film has been prepared by screen printing with the curing temperature of 100? and curing time of2 h.The roughness,surface finish,and adhesion are 2.8?m,8~7 grade and 4A,respectively.