| The modern civil airborne electronic equipment and air traffic navigation equipment use more and more large scale integrated circuit.Large scale integrated circuit improves the complexity of the circuit board.Circuit board can be easily effected by external factors, such as temperature?vibration and malfunction,circuit board is easily get faulted.Circuit board failure has become one of the main fault on plane,and it's also a difficult problem in the field of civil aviation maintenance. Infrared thermal imaging nondestructive failure detection technique can judge whether there is fault according to the circuit board's thermal distribution.This kind of non-contact fault detection technology of non-contact greatly improves the positioning speed and accuracy for circuit board fault test.This paper designs a method that combines the infrared thermal imaging technology of fault diagnosis and Labview virtual instrument technology to complete the chip circuit board fault testing.This thesis firstly researches the registration method of infrared image,and proposes the method of multi-parameter subsection mutation genetic algorithm,it solves the problem of infrared image registration in time series in the same coordinate,this method improves the registration accuracy.Then this thesis researches the infrared image chip area segmentation method,and proposes the method of interval parameter optimization pulse coupled neural network,it solves the intact segmentation of thermal chip of different temperature.This method improves the segmentation integrity. Then analyzing the circuit board function parameters,using Labview to write the control program of data acquisition and serial I/O port, signal generator,integrate all these modules to build a fault test system.By doing circuit board fault test on the fault test system,the result shows this test system can diagnose the circuit fault accurately and quickly.This test system improves the accuracy and efficiency of circuit fault test. |
PDF Full Text Request