Study On Copper Plating Process Of Barium Titanate Ceramics

Barium titanate ceramic is widely used in the field of capacitors, the electrode materials are generally silver, but the price is more expensive, the relevant enterprises hope to replace the silver base metal copper, reduce the cost of the capacitor products. In this paper, the electroless copper plating process of barium titanate ceramic was studied. In the experiment, the pretreatment of the surface of the ceramic substrate was improved, and the ultrasonic assisted removal of oil was made. At the same time, the related parameters of the plating solution were optimized, and the parameters were characterized by scanning electron microscopy and X- ray diffraction.The results show:(1)Pretreatment of barium titanate ceramic pieces includes four steps, including oil removal, coarsening, sensitization and activation. Coarsening is 20% concentration of hydrofluoric acid soaking ceramic 2min; sensitization and activation in the ceramic film is deposited on the surface of the catalyst layer crystallization center, a colloid, the chemical plating can be spontaneous.(2)that the best technological formula of electroless copper plating on the surface of barium titanate ceramic is: CuSO4·5H2O 16 g/L, HCHO 16 g/L, Na2 EDTA 14 g/L, KNaC4H4O6 18 g/L, T=40 ℃, NaOH 14 g/L, PH=12.5, potassium ferrocyanide and 2-2’-pyridine is a few. Under the optimum conditions, the coating surface is smooth, pale pink, with metallic luster, and the size of copper is uniform and compact, and the binding force of the coating is better. Coating composition for copper coating face centered cubic structure; the physical performance of the coating was better conductive performance excellent, good bonding strength.(3)Additive potassium ferrocyanide and 2,2’-bipyridine can significantly improve the appearance of the film surface morphology of the coating was more bright, continuous, micro copper grains are obviously refined, size is more uniform and compact, can to some extent improve the coating conductive performance, on the coating binding force effect is not obvious; improve coating degree of preferred orientation; improve the bath stability, delay bath natural decomposition of time.(4)Vacuum thermal evaporation and chemical plating two can get the surface continuity, showing pale pink, with a metallic luster of the copper film. Electroless plating can form a uniform coating on the surface of complex plating, which does not require a power supply. Vacuum thermal evaporation equipment is simple, easy to operate, no pollution, and so on.Through the experiment, to explore a dense surface bright, flat degree high, the physical properties are excellent copper controllable film deposition pathways, and provide a reference for ceramics base metal of capacitor ceramics electrode enterprises.