Research On Temperature Controllable Compact Heat Exchanger

With the development of semiconductor industry, more and more novel semiconductor materials come into our eyes. MOCVD(Metal organic chemical vapor Deposition) equipment is the foundation of the semiconductor industry. It can fabricate semiconductor single crystal under specific conditions. Temperature control is the most important during the process and the temperature of the spray structure is of great importance. Small efficient accurate high power heat exchangers and temperature controllers are used to achieve these functions. But these devices are rare in China. Most of the MOCVD fabricating companies have to buy such devices from abroad. It increases the cost and the devices are not conveninent to get technical support. So a compact heat exchange device is needed to be designed.Firstly, we simulate the PHE(Plate Heat Exchanger) which is the most important part in the device using CFD. The model of a single channel is built and the mesh grid sensitive is examined. We simulate the same model with different mesh size and compare the Nusselt number and friction factor. 0.65 mm is chosen as the best maximum mesh size. The simulation result is compared with other researchers' papers and is proved to be reliable.Then we use orthogonal experiment to find out the influence of different chevron parameters under the same working condition. This method allows researchers to study the influence of the parameters with fewer tests then traditional experiment method. The results are analyzed using statistical software SPSS. The evaluation factor is used to estimate the performance of the heat exchanger. The best chevron shape is found out after the research. Both single channel model and two channels model with this chevron shape are studied. The result shows that it is able to meet the need of the MOCVD equipment.At last, we design the schematic diagram of the heat exchange device and complete system design. We use as few sensors as possible to meet the need of the functions. The sensors and switches can protect the device in an emergency. Then the structure of the heat exchange device is designed using 3D software according to the schematic diagram.