Study On The Mechanism And Interface Behavior Of Glass-Metal/Silicon Connection Under Electric Field-assisted

In this paper,the concave electrodes were designed based on the principle of electric field superposition,and the silicon-glass tubes were connected.The influence of the length of the glass tube on the bonding current and the strength was studied.Glass-Mg was connected by composite method of anodic bonding and diffusion bonding by using aluminum foil as the intermediate layer,and the connection mechanism and the joint interface were analyzed.The effect of the thickness of the intermediate layer on the bonding strength of Glass-Mg was studied.Similarly,Glass-Zn was successfully bonded by composite method of anodic bonding and eutectic reaction brazing method using aluminum foil as the intermediate layer.The connection mechanism and microstructure were analyzed.The effect of temperature on the interface microstructure and joint strength was studied.In the atmosphere,the Glass-Brass was connected by composite method of anodic bonding and brazing by using aluminum foil and solder as the intermediate layer.The interface structure and joint strength of the joints were analyzed.This paper draws the following conclusion:The bonding current of silicon-glass tube decreased as the length of the glass tube increased,and the bonding current of silicon-glass tube when using the concave electrode was greater than the current when the parallel electrode was used under the same conditions,and the bonding strength was also greater by using the concave electrode,and its interface structure was good.The interface of the Glass-Al-Mg joint was good,free of holes and cracks.When the thickness of the intermediate layer aluminum foil was 30-100μm,the bonding strength of Glass-Al-Mg increased first and then decreased,and the bonding strength was maximum when the thickness of the intermediate layer aluminum foil was 50μm.Tensile fracture occurred in the glass matrix,and the fracture pattern was a river pattern,belonging to the brittle fracture.The interface of the Glass-Al-Zn joints was good,and the influence of the temperature on the microstructure of the Glass-Al interface was small.The total width of the diffusion layer increased with increasing temperature at the Al-Zn interface.At 450°C,needle-like Zn₆Al₅ crystal grains appeared at the Al-Zn interface.At 460°C,a clear"metal line"appeared in the diffusion region,and a large number of Zn₂Al crystal grains with different lengths appeared on the right side.At 470°C,Zn₂Al crystal grains appeared"accumulation"near the"metal wire".The bonding strength of Glass-Al-Zn decreased with the increase of temperature,and its tensile failure mainly failed in the glass matrix and is brittle fracture.The interface of Glass-Al-Solder-Brass joint was smooth and well-defined.Al₈ZnSn₄ was formed at the interface of Al/Sn-9Zn solder.The Sn-9Zn solder/Cu interface was well-bonded and the interface was even and straight,and CuSn new phase diffusion layer was formed at its interface.The fracture occured in the glass matrix and was brittle fracture.