As the binding phase,glass frit always plays an improtant role in electronic pasteand its properties affect the performance of the electronic paste directly.Because of the lowsoftening temperature,approachingthermal expansion coefficient and highchemical stability,leaded glass frit was once widely used in the market.With the enhancement of people’s environmental consciousness,leaded glass products have been banned for production and use,research of lead-free glass frit is imperative.A new kind of glass in the V2O5-P2O5-Bi2O3 system was exploratorily developed.Softening temperature of glass frit with different mass ratio were texted,and based on this,the mass ratio of the principle components of the glass was determined.Na2O、Li2O、CuO、Sb2O3 and B2O3 were added with different mass ratioby the addition method.The effects of added oxides on the softening temperature,thermal expansion coefficient and chemical stability of the glass were analyzed by means of differential scanning calorimeter,thermal expansion text and chemical stability test.Copper conductive pastes and its films were prepared by glass frit of Li2O-10%、B2O3-7.5%and CuO-5.25%,the effects of these three kinds of glass frit on the resistivity of copper conductive film were studied by the texts of four-probes texter and SEM.The results show that:When V2O5:P2O5:Bi2O3=67%:28%:5%,glass frit has the lowestsofteningtemperature,itis325℃,thethermalexpansioncoefficientis10.595×10-6/℃,the weightlessness rate of immersion is 28.56%,weightlessness rate of pickling is 10.36%,weightlessness rate of alkali-leaching is 15.73%.When the content of Na2O and Li2O are 0%5%,glass softening temperaturerise up with the increase of the content of Na2O and Li2O,and when When the content of Na2O and Li2O are5%10%,Na2O will hindered the formation of glass,Li2O will break the structure of glass,cause the glass softening temperature drop off.When the content of CuO is 0%3.5%,the softening temperature drop off,When the content of CuO is 3.5%7%,the glass softening temperature rise up.The addition of Sb2O3 and B2O3 increase the glass phase,make the network more stable,so the softening temperature rise up.The addition of oxides make the thermal expansion coefficients of the glass change from 1.032×10-6/℃to18.328×10-6/℃,the changes of the thermal expansion coefficient are completely contrary to the changes of softening temperature:the softening temperatureincrease,cause thethermal expansion coefficient decline,the softening temperature decline,cause the thermal expansion coefficient increase.The chemical stability of the glassesare significantly increased by adding oxides,the weightlessness rate of immersion decrease to0.11%,weightlessness rate of pickling decrease to 0.95%,and weightlessness rate of alkali-leaching decrease to 0.1%.Copper conductive film which was prepared by Li2O-2.5glass frit has the lowest resistivity,the resistivity of it is 76.41mΩ·cm,copper conductive film which was prepared by CuO-5.25%glass frit has the best printing performance,and the surface of copper film is relatively smooth. |