Research On The Printing Technology And Performance Of LTCC Substrate

Low-temperature co-fired ceramic technology(LTCC)in the high-density microelectronic packaging has been widely used and attention,which LTCC substrate preparation technology is also paid more and more attention.In this paper,the glass /ceramic composite system was used as the ceramic material to explore the 3D printing process of LTCC substrate,including the influence of different process conditions on the slurry,the raw tiles and the substrate,and worked out the best ratio of the slurry,Printing process and sintering process,so as to ensure the stability of the substrate in use and reliability.In this paper,the preparation process of printing paste and the influence of various additives on the performance of the slurry were studied.The optimum preparation process of printing paste was explored as follows:Al2O3 and borosilicate milling time of 16 h,and then dry,grinding and mixing with a variety of additives for the final vacuum degassing,The drying time is 24 h,the stirring time is 3h,the time of degassing is 1h,the vacuum degree is 0.01 MPa.By studying the effect of the content of each additive on the viscosity of the slurry,it was found that the viscosity of the slurry increased with the increase of the binder content and decreased with the increase of the dispersant content.As the solid content increased and the viscosity of the slurry increases with the increase of the plasticizer content.When the binder / plasticizer is 3: 2,the viscosity of the slurry is minimized,and the flowability is the best.The content of the printing paste is 49% ~ 55%,the dispersant is 0.5% ~ 1.0%,the binder is 4% ~ 6%,the plasticizer is 2.7% ~ 4.0%,the solid content is 33% ~ 37%.The influence of the printing process parameters on LTCC substrate was studied.It was found that the thickness of the substrate was determined by the distance of the nozzleat the time of printing,and the method of avoiding cracking of the substrate during drying:Room temperature natural drying,control the thickness of the substrate,in addition to the distribution of the substrate powder and solvent content to be controlled.For the nozzle length,diameter and table movement speed on the printing process,through the experiment to obtain the best printing process parameters that when the nozzle diameter of0.16 mm,nozzle distance from the table distance of 0.2mm,the table movement Speed 6.67 mm / s,air pressure of 150 KPa,the best results of the printed substrate,surface roughness of 0.9278 um,thickness of 107.8um.The sintering process of LTCC substrate was studied by using the conventional solid-phase sintering method.The sintering temperature range of LTCC substrate was determined by TG analysis.On the basis of this,the effects of different sintering parameters on the macroscopic,microstructure and dielectric Performance impact.The experimental results show that the ceramic substrate has a single phase and the grain is uniform after heating at room temperature from 400? to 10?/min and then keeping the temperature at 120? for 13?/ min.The shrinkage rate was 19% in the X direction,15%in the Y direction and 2.4 g / cm3 in the Y direction.The dielectric constant of the sample was 6.8 and the dielectric loss was 9×10-3 LTCC raw porcelain belt.