Manufacture And Studying Mechnical Properties Of Nanoporous Cu Film

In recent years, nano-materials has been applied in various aspects for its series of excellent properties and performance. More and more researchers pay their attentions and devote themselves to exploring better particular characteristics of nano-materials that are inseparable from the impact of surface effect. Nevertheless, until now there are much more research related to nano-materials that are worth us while to study. The preparation and mechanical properties of nanoporous Cu film are studied in this thesis,and the main content consists of the following three aspects:(a) The preparation of nanoporous Cu film is discussed. General methods to coat film contain electrochemical deposition method, evaporation film method, and magnetron sputtering method,which are mainly utilized to investigate Au-Ag alloy. After preparation of one-macrometer Cu-Zn alloy with a ratio two to eight by co-sputtering of magnetron sputtering method, nanoporous Cu film was obtained via dealloying corrosion method with acid solution that can etch active Zn. When coating film by magnetron sputtering method,a particular proportion of alloy can be obtained by the adjustment of the parameters, such as current,voltage and function time. In a addition, the corrosion process must be operated in an aseptic environment. And in the process of dealloying corrosion which is easier to obtain ideal film through titration corrosion and low sulfuric.(b). In order to further explore the mechanical properties of nanoporous Cu film,nanoindentation was introduced to carry out the test with press method, and the depth is 100nm.Common research of nanomaterials is primarily about their electrical conductivity, thermal conductivity and catalytic properties, while in this thesis we concentrate on the materials’mechanical properties. The results suggest that the elastic Modulous and hardness of nanoporous compared to macroscopic block Cu are separately increase one and nine times. so,it’s obvious that the properties of nanoporous Cu film are improved greatly compared with that of macroscopic Cu. Furthermore, microscopic nano Cu, wet nanoporous Cu film and dry nanoporous Cu film, the load-displacement curve of them are plotted which can visually displays that the performance gradient increase greatly, respectively. Therefore, the nanoporous film structure is helpful to enhance the elastic performance.(c) Last, the powerlaw hardening constitutive model suitable to film/silicon slice is obtained by dimensional analysis method. We employ ANSYS with finite element method to simulate the process of nanoidentation probe entering into nanoporous Cu film and substitute the parameters from test into ANSYS. Ten load steps are selected to model the press process, and in each step the load value is aubstituted into the constitutive model. Hence the yield strength and powerlaw hardening exponent of nanoporous Cu film are solved, 1069.88Mpa and 0.3255,respectively. We substitute relationship between stress and strain of the film further acquired into ANSYS, and then compare the deformation pattern with experimental data. The maximum defromation by model which is extremely close to by experiment. So it is believed that the data is reliable. Finally, the stress-strain curve of nanoporous Cu film and of macroscopic Cu bulk are drawn which visaully display the superiority of mechanical performance of nanoporous film than that of macroscopic materials.