This project is about TC4 surface hot dipping alumetizing processing doping with rare earth elements. Expecting to obtain Ti and Al intermetallic compound layer on it. Discuss the role of rare earth on coating and find out the optimum adding amount. We analyzed the morphology, thickness and structure of the Ti surface and Ti alloy surface hot-dipped Al layer by metallographic microscope,SEM,XRD. In the paper there is a discussion on the influence of different time of hot dip plating, plating aid and thermal diffusion temperature and time on the organizational structure of the compound layer.compared with doping rare earth in Al coating.The mechanism for the formation of Ti and Al coating under different process conditions is studied.Study shows that using saturated K2ZrF6 solution as the plating assistant in the process of hot dip aluminized is very good. Time of hot-dipped Al has no significant effect on the thickness and structure and performance after thermal diffusion. The interface between compound layer and the Ti alloy is smooth, so is the interface between the layers. There appears much oxides in the outer diffusion layer, such as Al oxide and Ti oxide,etc.Analysis shows that the main phase for compound layer is TiAl3 doping rare earth in Al coating, which has obvious enhancing effect for the combination of coating and TC4. After the addition of rare earth elements, with the adding amount increasing, the coating thickness increases, the amount of about 0.8% to attain maximum, in which achieve a good wear resistance and obtain good heat diffusion effect of the diffusion temperature and thermal diffusion time is very short. |