Study On The Fabrication Of Microstructures In Glass Materials By Femtosecond Laser

Femtosecond laser micromachining of transparent materials in recent years has become one of the hot research scholars. Femtosecond laser has the unique characteristics of high precision, small thermal damage and high processing rate, and has broad prospects for application in the micro structure of manufacturing. In a transparent material quartz glass has optical properties of good high temperature resistance, corrosion resistance and high ultraviolet to infrared laser absorption efficiency, and has become the preferred material for micro channel processing.The femtosecond laser processing with high hardness and brittleness of silicon carbide, exploring Micro Grooves has a wide range of applications in industrial production. Laser back wet-etching as compared with direct laser etching method and a laser-induced plasma etching method, can be processed micropores with a higher aspect ratio, this experiment using this method. In this dissertation, the Ti: sapphire femtosecond lasers to achieve micropores quartz glass etching and silicon carbide micro slot ablation,changing the laser parameters(laser power, the etching rate, focusing microscope, focusing lens and adjusting the waveform to do the experiment, the use of super-depth microscopy and scanning electron microscopy detects and analyzes the surface morphology of microstructure.The main research contents include:(1) In the laser back wet etching of quartz glass, analyzing laser process parameters on the depth and edge quality microporous, including laser power, the etching speed, focusing microscope(4x, 20 x and 50x) and focusing lens. And the laser waveform shaping processing to explore the quality of micropores, through the above analysis to select the best process parameters.(2) Conduct the etching experiments of Micropores using the optimization of experimental parameters, analyze the morphology of the upper and lower surfaces and inner structure, observe the upper and lower surfaces of the case crack, pore size and damage around the area, whether the formation of the bore wall structure. Use colored alcohol solution penetrating the micropores, real-time observe the situation and depth of colored(3) solution into the micropores under the super-depth microscopy, finally, measure the actual depth of the micropores.(4) In direct laser ablation of silicon carbide experiments, analyze laser power and laser focus at different locations materials on the influence of ablation experimental results, using the scanning electron microscopy observe the ablation morphologies of line structure at the bottom and inside, and the morphologies around the ablation affected zone. Measure the groove depth and width, and ultimately select the best process parameters.(5) Analyze the morphology effect of micro groove ablation under the focusing microscope(20x and 50x) and focusing lens, explore the characters of removing Si C material and the reason of ablating different groove shape in both focus mode, by contrast, obtain the best way of machining the high-precision and smooth micro-grooves.