The Preparation Of High Temperature Resistant Epoxy Resin Adhesive Curing At Room Temperature And Its Bonding Mechanism Research

At present, there is a big gap between China’s adhesive technology and foreign especially the United States and Russia and other space powers. And most of them are in theoretical or experimental research, and there is a great distance between the practical application and the practical application. In this paper, the basic formulas of two different adhesives were improved. Through comparison of several kinds of epoxy resin and amine curing agent pairwise with the income of the cured TGA results, we selected the better heat resistant novolac epoxy 638 resin/polyethylene polyamine system, adding 1,6-glycol diglycidyl ether diluent to reduce the system viscosity, adding aluminum zirconium coupling agent to improve the dispersion of the system, adding titanium carbide to improve heat resistance, and adding calcium oxide to reduce volatile emission at high temperature. The tensile shear test, carried out at room temperature and high temperature treatment on adhesive sample preparation results show that the prepared high temperature resistant epoxy resin adhesive with high temperature adhesive strength, but lower bonding strength at room temperature. Adding AG-80 and E44 epoxy resin in phenolic epoxy resin 638, improves the performance of the adhesive bonding at room temperature, while the improved formula has good heat aging resistance, long-term operating temperature of more than 280℃. In addition, using the analytical methods of TG-FTIR, TG-MS, Py-GC/MS, calcination, XPS, EA, etc., a preliminary study on the mechanism of high temperature adhesive bonding has been carried out respectively from the two aspects of organic and inorganic components of the adhesive, and it is proved that the adhesive has good heat resistance under anaerobic conditions or in short contact with air. The organic component of the adhesive is formed by chemical vapor deposition in the process of pyrolysis, which is attached to the outside of the inorganic component and forms a layer of carbon coating. This makes the adhesive at high temperature also has a more stable structure, can provide better high temperature bonding strength.