Modeling Of Discontinuities And Design Of Delay Line Circuit Based On LTCC Technology

Multichip-Module(MCM) is widely used in the system of small, lightweight, highperformance. In recent years, as a member of the MCM, because of its low-loss, highreliability, multifunction, high-integration, Low Temperature Co-fired Ceramic(LTCC) technique is becoming more and more prosperous. Multilayer wiring capability of LTCC can effectively reduce the volume and weight, improve reliability and integration in the design of the delay line components.In this thesis, the related problems of the LTCC technique in the design of the delay line have been studied. It has established the model of discontinuous structure and designed the delay line components. At the same time, some useful conclusions are obtained. The main research works are as the following:1. Accurate method of testing phase: This paper proposes a method of accurate test phase delay based on the power-on delay of vector network analyzer. Actual verified the feasibility and accuracy.2. LTCC isolation structure model: LTCC characteristics of high density and high integration density will cause the coupling between the lines. Therefore, it is necessary to establish the isolation structure. In this paper, it has established the model of two isolation structures, which are ground via column isolation and the ground plane isolation. The simulation is done through the High Frequency Structure Simulator(HFSS). The simulation results show that the two isolation structures can effectively achieve isolation. While the measured results and simulation results are identical with each other.3. The interconnections between LTCC layers structure model: It is needed to consider inter-layer interconnect structure in the Application of LTCC multilayer technology. It is significant to have simulation and modeling of interconnect structures. This paper analyzes the interconnection characteristics of the microstrip line to stripline transition structure, optimize the relative size of the through-hole interconnection structure. It provides the basis for subsequent design work.4. LTCC delay line component design: It has processed a delay line components using multilayer structure based on the LTCC technology. The main delay section achieved by the two-layer stripline with through-hole interconnection structure. In this paper analyzes the coupling between the parallel striplines and the effect of corner on phase and standing wave. And then has the simulation of the model in delay segments and straight segments. A 6-path LTCC delay component work in Ka-band is designed. The size of LTCC delay component is 63mm×40mm×15mm. The measured results meet the target requirements, the insertion loss is not more than 36 d B, the standing Wave is not extra than 2, the phase linearity is not more than 20o, while the passband ripple meet the demand.