Double-sided Grinding/Polishing Machine Structural Design And Study On Grinding Trajectory

With the development of information technology, market demand for sapphire substrates, poly silicon mono-crystalline silicon and other electronic devices on the substrate is increasing, at the same time, which make higher requirements on the quality of the surface. Double-sided grinding/polishing machine is the main equipment of the substrate were ultra-precision surface machining, so how to efficiently get super smooth without damaging the surface of the wafer has become a hot topic. At present, research and analysis of its structure and polishing mechanism behind the developed countries, our paper is preparing for an enterprise of the sapphire wafer processing needs, designing a super-precision double-sided grinding/polishing machine.Firstly, conduct the whole machine structural transformation and design. By analyzing the characteristics of the double sided grinding/polishing machine equipment and technical parameters, combined with grinding/polishing processing mechanism based on the original remove the measurements on the three dimensional modeling design; Meanwhile, the structure in the process of analysis and research to find out problems that is optimized to improve support and operating convenience.Secondly, Research on double sided grinding/polishing machine key parts dynamic and static analysis as well as the structure lightweight design. Simply expounds the principles and characteristics of dynamic and static analysis, selecting the main structure and components of the equipment to research on the static analysis.Having a knowledge of the displacement and deformation under the static displacement and the whole machine vibration frequency and vibration mode on the modal analysis. Based on the Workbench optimization analysis function and the quality of its key components of the structure of the lightweight optimization design.Then, according to the polishing process of the planetary motion in the form of vector method and the displacement method, Grinding and polishing trajectorymathematical model is set up, the trajectory simulation based on Matlab simulation analysis, adopting single factor choosing different factors: tooth lap ratio, polishing disk rotational speed, workpiece location for this research, it is concluded that the factors influence on grinding trajectory uniformity grinding track is the most complexly, the best uniformity of a set of process parameters.Finally, according to the theoretical analysis of orthogonal experiment analysis,selected from a set of optimum combination parameters, combined with the theoretical model to analyze the feasibility of the parameters, the feasibility of modeling and theoretical analysis is verified by experiment research.Analysis and conclusions of this paper, not only has practical value of doublesided grinding / polishing machine actual processing, and selecting operation and process parameters, but also provides a theoretical basis for future research.