Research On The High Speed And High Precision Platform

With the rapid development of IC industry in China, the demand of Chinese semiconductor assembly is increasing. But the domestic equipment mainly rely on import. At the same time, high-end equipment is embargoed to our country. It leads to the increase of cost. Therefore, it has the vital significance to study the high speed and high precision platform.Based on the research and analysis of the existing high speed and high precision mechanisms, this paper proposes a 2-degree of freedom redundant parallel manipulator which is suitable for high speed and high precision according to the task requirements and technical index of semiconductor packaging equipment. Closed loop vector method is used to analyze the kinematics to obtain the forward solution and inverse solution. On this basis, the velocity and acceleration characteristics of the mechanism was analyzed; According to the task requirements of semiconductor packaging equipment, velocity and acceleration of positioning platform are planned and the workspace of is analysed.Based on the Jacobi matrix, the paper studys the dexterity and singularity of the redundant parallel manipulator. The singular characteristic of the mechanism is analysed as the theoretical basis to avoid the position of singularity. T he index of dexterity is established on the basis of Jacobi matrix. The distribution of dexterity index is analysed to select one distribution which is best.The rigid body dynamic model of parallel manipulator is established based on Lagrange method. Numerical simulation of the dynamic characteristics is realized by the use of MATLAB and analysed. Based on the rigid body dynamic model, the elastic dynamic is builded. The numerical solution of the dynamic response of parallel manipulator is solved by using the precise integration method and the effect of elastic deformation for positioning accuracy is analysed. The inherent frequency characteristics is studyed to avoid the vibration frequency of parallel manipulator.In-depth study of chaos theory, the parper applies it to the parameter optimization of the redundant parallel manipulator. Through the comparative study of the ergodicity of existing typical chaotic sequence, the ergodicity index is put forward. this paper selected a applicative sequence for chaos optimization algorithm and improve the existing algorithm to avoid falling into local optimal results. Then the paper used the improved algorithm to optimize the parameters of the robot.