The Thermal Analysis Of Microwave Passive Components

With the rapid development of microwave devices, the higher properties of microwave devices are required. In practical work process of microwave devices, a certain temperature rising is always happened with a part of the energy of microwave devices converted into heat energy, with will change the certain deformation and the electromagnetic properties of the microwave devices. So the thermal analysis and thermal design has been become the necessary factors in the design and manufacture of the microwave devices.This article will combine subject "high-power amplifier reflection loss research on EMC tests", to thermal analysis for passive microwave devices. This article mainly done the following work:First, the development situation and the status quo of thermal analysis are introduced, and the theory of thermal analysis and thermal design is introduced too. Including the research methods of thermal reliability and thermal analysis, the current research status of thermal analysis and thermal design, the influence of temperature on the reliability mainly.Second, the theory of heat transfer is introduced. There are three ways of heat transfer mainly: heat conduction, convection and radiation. Combined with the actual situation of the microwave devices, the way of heat transfer in the thermal conduction is discussed mainly and the convection and radiation are not disscussed. And then introduced the thermal elastic mechanics theory, the structure of microwave device model has been changed certainly by the temperature rised.Third, in this paper, the thermal analysis of three kinds of passive microwave devices are studied, including filters, couplers and microstrip antenna. The basic design theory of filters, coupler and microstrips antenna are introduced too. The original model of filter, coupler and microstrip antenna electromagnetic simulation have been done. The temperature analysis and thermal stress structure simulation for three kinds of microwave passive components have been studied. Finally, the deformation models electromagnetic simulation of three kinds microwave passive components are studied.Fourth, for the next step work is prospected, including increased heat transfer way, reasonable planning structure and increased the cooling area, etc.