Study On The Grinding Technology Of Narrow Channel Array On Large Size Monocrystalline Silicon Plate

Monocrystalline silicon is widely used in optics, electronics, machinery. chemical and other fields for its high heat transfer coefficient, low density and low expansion coefficient, excellent optical performance and many other advantages. Especially for its excellent thermal-physical properties and optical machinability. it is widely used in high power laser resonant cavity mirror with mini/micro channel cooling structure. With the development of science and technology, The size of monocrystalline silicon substrate with micro channel is larger and larger, leading to more and more tasks to be completed. As a typical hard and brittle semiconductor material, the monocrystalline silicon has been researched for chip manufacturing and micro-nano processing as the main research direction for a long time.Most of the processing method is not suitable for its hard and brittle properties when machining narrow/micro channel or structures on silicon substrate. From the present researches in precision machining of hard and brittle materials at home and abroad, precision grinding of hard and brittle material with diamond grinding wheel represents the main research direction of its precision machining technology. As a kind of form grinding method, creep feed grinding has the characteristics of high precision, high efficiency and low damage, it must also be an effective channel processing method. It is easy to form defects such as edge chipping, cracks, breakage, and wear of grinding wheel etc., when some other hard and brittle materials grouded by diamond wheel. For creep feed grinding of monocrystalline silicon, there is not enough researches at home and abroad right now, but it is certain that such problems still exist from the universality and generality. Therefore, a closer study on the creep feed grinding of monocrystalline silicon to improve the efficiency. precision and surface integrity, some problems must be addressed so as to promote the its application.This paper focuses on the solutions of problems occurred during creep feed grinding of monocrystalline silicon, in order to improve the processing efficiency, the processing precision and surface integrity, some experiments were done. The main work and results are listed as following:(1) the effect of grinding wheel bond types and the grinding conditions on quality of the creep feed grinding of monocrystalline silicon is researched, and find a reliable method to improve grinding surface integrity.(2) Wear behavior of diamond grinding wheel in the grinding process was studied, the diamond grinding.wheel gring ratio and its compensation and dressing criterion are determined.(3) further explored the preparation method of the irregular shaped grinding wheel and the gringding technology of trapezoidal micro groove、V shaped micro groove and silicon based Pyramid structures.