Research Of The Structure Of Vacuum Robot For Silicon Wafer Handling

Semiconductor industry requires equipments which runs in the super clean room should have the character of super clean class, anti-static and high reliability. So, the robot working in the IC industry should have the ability of handling wafer and the character as said above. Moreover, vacuum robot for silicon wafer handling is important in the semiconductor industry. Thus, there is necessarility to analyze the vacuum robot for silicon wafer handling.The main research works are as follows:(1) The style of transmission is analyzed, and the robot3D model is created by Solidworks. The coordinate system of vacuum robot for silicon wafer handling is created through the D-H method, based on which, solved the kinematics and inverse solution. And kinematics curves of specific condition are drew with calculation.(2)Basing on kinematics, dynamics of the robot were analyzed. Use Lagrange method established the dynamic equation of the robot. And the torque curve of specific condition is drew with calculation. Established the end effector of finite element analysis model, select the most dangerous stress state as the analysis condition.(3) The model of Solidworks is imported to Adams. Then, add restrain and drive to create the virtual model machine. Draw the curves of kinematics and dynamics in the specific condition. And compare the curves with the calculation. So, we can draw the curves in norm condition to analyze the character of vacuum robot. The result could guide our thinking of design.(4) Establish the model of error of vacuum robot. Combine the method of position measurement and the method of position matching to program the algorithm of calibration. Then, calculate the errors of the vacuum robot. Use the new parameter of the vacuum robot to establish the model of the robot. Last, Comparing the errors before calibration and after calibration, We know calibration necessary.