The DFM Of High Reliability Surface Mount Glass Small Current Schottky

This article describes the research background and significance of Surface Mounted Low current Schottky Diodes, analyses its present developing status and trend and discusses its structure and characteristics and describes its basic structure and operating principle.According to circuit design and to form series products, establish the research objectives, details the electrical parameters and reliability index. According to the research objectives and design experience, design the vertical and horizontal parameters of Low Current Surface Mounted Schottky Diodes. The Vertical parameters include the selection of substrate and epitaxial layer impurity concentration,Schottky barrier metal selection and forward and reverse parameter determination and calculation,the horizontal parameters is mainly the design of layout calculation. The high reliability structural design mainly includes metal-silicide---Silicon barrier, protection ring, multilayer metallization and package reliability.The core phase of the study on process design and product realization. The article details the chip manufacturing process technology research, Research on High Temperature metallurgical bonding technology and Introduction to the entire process design and product realization. The chip manufacturing technology research mainly study how Schottky diodes meet the high temperature of high-temperature sintering process(620C for at least10minutes),which relates to annealing, multilayer metal electrode fabrication, multilayer metal electrode etching and lithography, Naturaloxide layer removing and alloying process. High-temperature metallurgical bonding process mainly analyze the formation mechanism of high temperature metallurgical bonding and choose the rational material. Make test on selected material on chip technology and sintering process to discover the high-temperature metallurgical bonding process conditions, using energy spectroscopy method to get high-temperature metallurgical bonding composition, combining with the test to design high-temperature metallurgical bonding process. The entire process is designed to achieve electrical parameters and reliability requirement. Product realization introduces parameter test and reliability test.Summary and prospect:it mainly introduce the research characteristic and future trend.The summary mainly includes technology performance, new technology design, new structure, new material design and reliability design. The prospect involves new research fields and the popularization and application of the research results.