Study On The Influence Of LED Encapsulation Process Structure To The Photochromic Parameters And The Cooling System

As a new type of lighting device, LED has the advantage of high luminous efficiency, high reliability, small volume, environmental protection and long durability, and is the development direction of future lighting technology. With continuous development of LED industry, the market puts forward higher requirements on packaging technology. Improvement of brightness, color rendering and other optical parameter of LED devices become urgent problem to be solved. Strong heat dissipation has become an essential prerequisite for power LED application.At present, most packaging companies are looking for best packaging technology, the focus of which are choices of packaging material, design of heat dissipation structure, and control of production process and quality. Only when these issues are solved can LED performance (efficiency, life, etc.) be maintained. From the current development prospects of LED industry and the technical problems facing to be solved urgently, the study of existing packaging structure and process has practical value to tube light color parameters and thermal reliability.This article achieves LED packaging methods of varies fields through the LED packaging technology research; realizes white LED packaging technology of high efficient, low color temperature and high color rendering by optimizing the LED fluorescent powder coating process; realizes reliability evaluation theory of low resistance LED encapsulation and device through the research of Eutectic welding technology.Main contents of this Project are as follows:1. Research influence of different LED encapsulation structure to color parameters. Through contrast experiment of different forms of packaging, research its influence to LED spectral luminous efficiency. 2. Research the influence of different phosphors coated process to white LED light color parameters. To improve the rendering properties and long-term maintenance rate, through the phosphor coating technology improvement, the fluorescent powder curing mechanism and the influence to LED efficiency and color parameter. At the same time research influence of fluorescent powder coating process to color temperature.3. Research of LED welding technology. To analyze its effect on the reliability of the device, by researching LED heat dissipation bottleneck and reducing thermal resistance methods.