Study On Preparation And Properties Of Conductive Silver Paste For Electronic Packaging

In this paper, the preparation and performance of a kind of Ag filled conductive adhesive were studied. a kind of electronic encapsulation conductive adhesive was successfully developed,it is important for instead of Tin-lead solder, protect the environment, satisfied with the electronic integrated circuit encapsulation. and the performance of Ag filled conductive adhesive was tested, meet with production.Firstly, the materials of Ag conductive adhesive was introduced and a detailed principle of every material selection was put forward. the components of thermosetting silver conductive adhesive were confirmed: Epoxy resin(E51 type) as the matrix resin, Anhydride compounds(methyl, dick anhydride) as curing agent, imidazoles compounds(2- has a base- 4 methyl imidazole) as a promoter, 1 ~ 3 microns flake silver powders as conductive filler.Secondly, the best proportion of Ag conductive adhesive was designed through experiment. The result was that epoxy: hard:Ag: accelerant equal to 100: 80:126:0.6.Thirdly, in this paper curing time,the amount of accelerant and Ag was studied for Ag conductive adhesive, also additives effect on the properties of conductive adhesive, the influence of high temperature on the electrical properties of conductive adhesive, conductive accelerator(DBGE)effect on the electrical properties of conductive adhesive,the diluent influence of the screen printing of silver conductive adhesive was studied. The results was that: the larger amount of silver particles, the lower resistivity of conductive adhesive; with large amount of silver, the silver conductive adhesive had low volume resistivity, but adhesion strength was also decreased,With the increase of toughening dose, the shear strength of Silver conductive adhesive continues to increase, but the conductive properties of cutting showed decreasing trend; silver conductive adhesive by adding coupling agent, accelerant, diluent can greatly improve the conductivity of silver conductive adhesive; through the experimental show that the conductive adhesive has the advantages of high temperature resistance performance.The preparation process of silver conductive adhesive was studied, the electrical properties of conductive adhesive was tested, the volume resistivity measuring: 7.2 ×10-4 ??cm; determination of tensile shear strength of the homemade Silver conductive adhesive by using mechanics of material experiment machine, Silver conductive adhesive of shear strength achieve at 14.6(MPa), basically meet the production, In this paper, Through the research of conductive silver conductive adhesive, provides theoretical and experimental basis for the future study of silver conductive adhesive.