Research On The Bending Forming And Bending Device Of The Jack Of Printed Circuit Board

As one of the basic components of electronic equipment, the electrical connector can achieve the connection and separation between electrical terminals, signal and energy transmission and other functions. It is widely used in aviation, electronics, machinery and national defense and many other fields. There are a wide variety of micro rectangular electric connectors, including curved plug PCB electrical connector most widely used. The electrical connector jack in the cold bending forming process, prone to instability wrinkles, springback angle defects, has a significant impact on connection performance and service life. Aiming at the printed circuit board electrical connector jack roll forming technology, the paper conducts a study and investigate the effect of different parameters on the springback and distribution of the residual stress during cold bending, and innovatively designed a set of bending device of jack.Finally, the rationality of the mold structure was verified by experiments. The contents of this paper are as follows:(1) Study on bending forming mechanism of jack and forming defects form. Establish the piecewise nonlinear constitutive equation of jack. According to the force state of the jack, the mechanical balance equation is established, and the stress and strain state of the jack bending process is analyzed.The approximate calculation formula of the spring back is deduced, and the main factors affecting the bending springback are analyzed.(2) Based on finite element analysis software ABAQUS, a finite element model of bending jack is established. To study the affect of geometric parameters and process parameters to jack’s bending springback angle and the springback radius were investigated by single factor method.The springback angle increases with the increase of the bending angle, springback radius decreases with the increase of the bending angle; Springback angle and the springback radius were increase with the increases of relative bending radius, the friction coefficient between the positioning block with jack and the die clearance; Bending speed and the friction coefficient between the bending block with jack are not obviously affected on the bending springback angle and the spring back radius.(3)The bending springback control method of jack is studied.For the jack bending forming characteristics, die surface control method was puts forwarded as the method of effective controlof springback. Then, the bending angle and the bending radius of the base model of the jack bending process were calculated by springback compensation method of the die surface iteration.(4)Through analysis the process of the bending jack, the bending of the jack is determined.According to the various parameters on the springback of the jack, the bending device of the electric connector jack of the printed circuit board is innovatively designed. The design of the main parts is analyzed, and the bending force and die structure size are calculated. Finally,trial-produce the mold and verify the rationality of the design of the mold through the jack of the bending experiment to.