Airborne Radio Module Microchannel Heat Dissipation Characterics And Process Analysis

With the integration of the electronic module increasing, smaller and smaller, and a heat dissipating material selected module substrate of the electronic module is becoming increasingly important. LTCC(Low Temperature Co-fired Ceramic) material have much good property,such as high-density integrated, good RF performance, digital fast response, high frequency, high Q characteristics and high transmission performance, and it can adapt to the requirements of large currents and high temperature properties. LTCC multilayer technology enables a variety of integrated circuits and electronic components of an electronic module, so that both can reduce the difficulty of assembling an electronic system and to reduce insertion loss; therefore, LTCC module has been integrated in the electronic communications sector more and more widely used. This paper studies in LTCC substrate material for airborne RF module cooling demand; the microchannel technology for LTCC substrate with thermal solution highly integrated electronic modules problem.First, this paper analyzed the airborne RF module cooling demand and cooling distribution, combined heat situation RF module, the structural requirements of airborne communication systems as well as the feasibility of LTCC technology, design-ed a new type of direct straightening out the type of RF Micro Channel Architecture module cooling scheme. This micro-channel designed within the LTCC substrate, the opening in the top of the substrate, thus saving board space around the air, it will not take up too much at the top of the mount chip substrate area. Then, using factorial experimental analysis of the cross-sectional shape of the microchannel parameters: aspect ratio, porosity, hydraulic diameter of the cooling efficiency and the impact of the import and export of the size of the pressure loss, and the most suitable for this study based on factorial analysis of election results Size of RF modules.Since the lamination and integration of the LTCC firing process microchannel may be deformed. So for this design staggered microchannel structure parameters LTCC process analysis and process optimization. First, analyzing the lamination process, the lamination process obtained parameters temperature, time, pressure curves of deformation microchannel; obtaining appropriate process parameters based on the curve and the simulation results. Due to the optimization of process parameters do not control the deformation of microchannels within the allowable range, we further optimized the process: the micro-channel. add carbon-based composite material during lamination as support, then evaporated it in the sintering process. According to its major chemical change occured, the sintering process can be divided into stages debinding and sintering stages; where the quality of the micro-channel forming the greatest impact is in the heating process of these two phases; through the different heating rates were simulated results the optimum temperature profile. Finally, according to the production process LTCC RF modules optimized sample, and using 3D shape measurement precision optical instrument to measure the size of the microchannel structure, deformation of less than 8% to meet the design requirements of its stress test and tightness test.