Study On The Relationship Between Contact Resistance And Temperature Rise Of GIS

The defects in GIS equipment manufacturing process and ageing of insulation, heating and other factors in the process of long time operation should cause it to malfunction. Temperature is an important index for evaluating the operational status of GIS, contact resistance, whose value bears high enough reliability on circuit connection state check, is the key parameter to characterize the connection of circuit. When the value of contact resistance varies, diversification of the overall temperature distribution in GIS will follow, which is the reason why the corresponding study, forced on the method based on the overall temperature distribution in GIS, will be carried on.Firstly, the simplified simulation 2D/3D models have been built and the Temporary, steady-state simulations considering multi-factors under COMSOL Multiphysics also have been carried out. And further simulation study of the conductor shell material, the convective heat transfer coefficient, radiation coefficient and contact resistance on the GIS equipment temperature rise, which also indicated that the most influential factors of temperature rise are conductor shell material, contact resistance and the coefficient of convective heat transfer, and the effects of the radiation coefficient are not significant.Secondly, in order to obtain the specific relationship between contact resistance and its temperature rise, comparison of simulation and experimental results on the 126kVGIS equipment, and analysis the results of the simulation and test of 126kVGIS equipment, an experiment platform is set up to simulate the operating condition of the 126kV GIS and its current carrying conductor and connecting piece temperature distribution is mapped by thermocouple. The last, with the comparison of the results from both experiments and simulations, the relationships between Contact resistance variation and the GIS temperature distribution are calibrated, acquired specific mapping relationship between contact resistance and temperature, the condition assessment can be measured by the GIS temperature rise.