An Experimental Research And Design Of The Performance Of Vertical Heat-Pipe-Type Semiconductor Heating And Cooling Box

In recent years,semiconductor refrigeration technology has been got rapid development in many areas.Increasingly prominent to show its unique superiority and extensive applicability.Especially in all kinds of cold storage refrigeration apparatus,energy conservation,takes up less space,no noise,no pollution of the semiconductor refrigeration is increasingly aroused people’s attention,occupies an important position.Such as automotive refrigerator,medical vaccines and blood storage,test sample preservation of field operations, the hotel’s wine reserve and so on.Therefore,based on the background of environmental protection,studying how to proceed effective refrigeration under the limited space,designing and developing a less energy,saving space.strong practicability of energy storage devices,it has very realistic significance and broad market prospect.This text on the basis of reviewing a large number of literature and consulting related experimental research of semiconductor refrigeration system, successfully developed a small vertical heat pipe type heating and cooling storage box for the first time.At the same time,proceeding experimental determination about the related performance parameters of semiconductor refrigeration and obtaining the important conclusion,and in the application of the test, the improved design scheme is put forward.First, building a test bench in view of the semiconductor refrigeration system of cooling and heating box. Against the heat conduction performance of the connection between the components,proceed a theoretical analysis and experimental contrast research.Based on the results of the study,using hollow type gasket and hollow type insulation sleeve can reduce the unnecessary heat loss when the refrigeration system operation occurs.Second, in the different heat transfer ways of hot side,and different working conditions,proceeding a comprehensive experiments research on performance parameters of the refrigeration system.Conducting collation and research analysis for the hundreds of experiments data.Determine heat pipe and air cooling pattern is the best way to transfer heat,12V,6.4A,is the best operation conditions in the design temperature box,to optimize semiconductor refrigeration cooling performance of the system during actual work;Then, based on research results,completing the whole improvement design of vertical heat pipe type heating and cooling device.And in a cold box system of semiconductor refrigeration,storage box is used to store cold quantity when the system is power shortage.Through the low freezing point of cool storage material release cold energy to keep the temperature in the cold box.lt can be achieved a simple refrigeration environmental condi- Tions. and the refrigerated containers can maintain a longer storage time.Finally, in view of the actual working status of design heating and cooling box,carried on a performance test for inside temperature,when there is have or no load in the heating and cooling box. And measured the release cold performance when the power system is shortage. Accordingly put forward questions, and given the overall design improvements for solve the problems.Further study of these factors for the impact of development of the semiconductor refrigeration technology,has an important theoretical reference value,accumulate data for further study.The design of vertical heat pipe type semiconductor cooling and heating box laid the research foundation for practical application and market promotion.