Study On New Packaging Technology Of Electric Cars’ High Power IGBT Module Inverter

Electric vehicles, hybrid vehicles, fuel cell cars as the representative of Newenergy vehicles is one of the most important industries to achieve energy-savingemission reduction targets. IGBT module as the core of the new energy vehicles, itsdevelopment has been widely concerned. Improving the packaging method is the keypoint.This article points out the defects of packaging materials presented in thepackaging process of electric vehicle inverter for high power IGBT module, andintroduces a new kind of connection materials, nano-silver paste.In order to verify the connection properties of nano-silver paste, to determinewhether it is appropriate to be used in the manufacture of IGBT module, this paperdesigned a single analog chip sintering experiment. Through the micro X-raytomography, shear test, scanning electron microscope, the connection layer sinteredwas full-range tested, results show that even though no obvious flaws was found inthe connection layer, but shear strength was not very satisfactory. Analyzing suggeststhat the quality of magnetron sputtering coating may be not very reliable. Theexperiment went on with another connection experimental sintering use really chipand small silver-coated copper, the connection is good, the process of shearexperiments, found the damage first appeared in the chip, this proves that theconnection quality is reliable. So the nano-silver paste can be used in the manufactureof IGBT module.Next is to introduce the sintered nano-silver paste method to the making of IGBTmodule. Using the similar operation process as the single chip sintered as before, thewhole module is sintered. The micro X-ray tomography presents the good quality ofthe sintered layer. The sintered module should go through the shell design andmanufacturing, wire, glue, assembling process, so as to obtain the final product. Theelectrical specifications are measured by transistor tester.