Study On The Flow And Heat-transfer Properties Of CPU Heat-Sink

Along with the three major development trend of high performance,miniaturization, integration in electronic industry, heat flux produced by highlyintegrated electronic chip was also significantly increased, and now the heat issue hasbecome a bottleneck in the development of today’s electronics industry, especially forhigh thermal sensitivity in terms of CPU heat sink. With its efficient heat dissipationability and the use of convenient, heat sink become today’s most widely used way ofheat dissipation. In this paper, the different structure of CPU water cooling heat sinkis studied.Firstly, a3-D numerical study on the flow and heat transfer of differentcross-sectional of parallel channle heat sinks is conducted. When the samehydraulic diameter, heat transfer coefficient of circular channel heat sink is1.4timesthan rectangular channel heat, and the pressure drop of circular channel heat sink is1.31times than the rectangular heat sink. Secondly, the flow and heat transferperformance of different slopes of wedge-channel heat sink is numerically studied,and comparing with straight parallel rectangular channel heat sink. The maximumtemperature of wedge channel heat sink is0.962K lower than the rectangular channelheat sink, the thermal resistance can be reduced by16.88%, and wedge-channel heatsink has a more uniform temperature distribution. Besides, the temperature differencebetween import and export at the bottom surface of wedge-channel heat sink is small.Finally, in order to get a heat sink of better cooling effect and more uniformtemperature distribution, on the basis of the above findings, this paper proposes acurved channel heat sink. Compared with the rectangular channel heat sink, curvedchannel heat sink’s Nusselt number is increased by27.32%, and can achieve a moreuniform temperature distribution, so the curved channel heat sink structure can beeffectively enhanced coupling heat transfer. Meanwhile, the authors build awater-cooled bench, and doing experiments to study the heat transfer performance ofcurved channel. When the heating power is170W and flow rate is133L/h, thetemperature at the bottom surface of heat sink is34.7℃, and CPU can worknormally. Based on the experimental date, this paper proves the good thermalperformance of curved channel heat sink.