| With the rapid development of microelectronics technology, electronic devicetrends to be ultra-miniaturized and highly integrated, and thus the heat flux density isbecoming more and more intensive. However, it is of great importance to theelectronics’ miniaturization that the heat will spread out from the internal with highefficiency in a short time. Fin, as a familiar heat transfer enhancement technology, playsan important role in the field of device cooling. And then fin’s optimization becomesextremely significant.Based on the minimum principle of entransy dissipation that when the heat flow isconstant, the dimensionless equivalent thermal resistance is least, this paper optimizesthe structure of element leaf-like fins and first level leaf-like fins. Firstly, with theacquired thoery of heat transfer and entransy dissipation, this paper deduces thetemperature field and heat flow in the fin with the element and first level, and then turnsthe entransy function and dimensionless equivalent thermal resistance out. Secondly,focusing on the optimization goal of dimensionless equivalent thermal resistanceminimium, this paper analyses the influence on leaf-like fin of each parameter with thehelp of MATLAB. Finally, on the given condition, the paper proposes the best structureof leaf-like fine both the element and the first level, and compares the heat exchangeperformance of the most optimized structure between element leaf-like fins and firstlevel leaf-like fins. |
