Research On Surface Features Of ZTA Ceramic Nanocomposites Using Ultrasonic And ELID Composite Grinding

Engineering ceramic materials which are widely used in various industrial fields have excellent performance.But compared with the metal material, they are still belong to high hard brittle materials, processed with the conventional processing method is easy to produce the quality defects such as cracks, crumbles. The effective method to solve this problem is realized shaping grinding of ceramic material to obtain good surface quality by using precision ultra-precision machining, and shaping grinding can be realized by changing the parameters of grinding to bring down the thickness of undeformation ship of single grits. Ultrasonic and ELID composite grinding is a new composite processing technology, it combines ultrasonic grinding high precision as well as the advantages of ELID mirror grinding,so it provides a new method for high precision processing of brittle materials. And the research of the thickness of undeformation chip of ultrasonic and ELID composite grinding is of great significance for realizing the plasticity removal of hard brittle material and getting good processing surfaces.This paper studies ZTA nano-composite ceramics of the ultrasonic and ELID composite grinding.First of all, the model of the thickness of undeformation chip of the ultrasonic and ELID composite grinding is established on the basis of summarizing the predecessors’ research, and the simulation analysis on the influence rules and the trend of sensitivity of various parameters on the thickness of undeformation chip has been done.The simulation results show that the thickness of undeformation chip increases with the increasing of grinding depth, decreases along with the increasing of the wheel line speed,workpiece speed,ultrasonic frequency,and ultrasonic amplitude.The sensitivity sequence to the thickness of undeformation chip is: swpa>>>>ΑVVf,At the same time, prediction model of surface roughness is established based on the thickness of undeformation chip to test and verify the correctness of the model.It can indirectly verify the correctness of the model of the thickness of undeformation chip by comparison the predicted values of surface roughness with experimental values.Second, through the observation and the measurement of the grinding effects such as grinding force, workpiece surface topography and the surface roughness in the process of grinding, analysis the relationship between the grinding effect and the thickness of undeformation chip, so do some experiment research on brittle ductile removal mechanism of ZTA nanocomposite ceramics. And the experimental results show that when the average thickness of undeformation chip is 1.565μm, the material removal mode shifts. When it is less than 1.565μm,the material removal is for plastic remove; but when more than 1.565μm,the material remove mode begins transforming to brittle.Finally, single grit cutting trajectory equation is set up under the ultrasonic and ELID composite grinding, giving the time that the single grit cuts into and out of the workpiece, and the vibration frequency of ultrasonic in the cutting zone. The simulation analysis on the effect of various parameters on the grinding grain, and the simulation results show that the large the ultrasonic amplitude, ultrasonic frequency, the grinding wheel speed is, the smaller the workpiece speed is; the more fine abrasive particle size is,the more intensive grinding surface texture is; the lower the surface roughness value is and the more smooth the surface is. Then to experimental research on the influence of grinding grain from the grinding wheel speed, workpiece speed, and abrasive particle size in three aspects, and the experimental results are consistent with the simulation results.