Electrochemical Preparation Of Micro-nano Structured Copper-based Superhydrophobic Surfaces

In recent years, superhydrophobic surfaces have attracted more and more attention due to their wide applications in self-cleaning coatings,anti-corrosion, flow drag reduction, anti-icing, water-proof coatings/fabrics, oil-water separation, and so on. Copper is a kind of widely used engineering metal and its surface superhydrophobicity is of wide interest.In this thesis, we try to develop some facile electrochemical methods to prepare superhydrophobic copper metal surfaces with micro/nanostructured coatings of Cu2S/CuS,Cu2O/Cu2 S and Cu/Cu2 Se.(1) Superhydrophobic Cu2S/CuS surfaces on Cu substrate can be facilely fabricated by square-wave potential pulses in NaOH solution and subsequent sulfurization in Na2 S solution. The maximal CA can reach157.5° without any post-treatment and surface modification.(2) Superhydrophobic Cu2O/Cu2 S surfaces on Cu substrate have been prepared by square-wave potential pulses in Na2S2O3 solution. And a maximum contact angle of 160° was achieved without performing surface modification.(3) Superhydrophobic Cu/Cu2 Se surfaces on Cu substrate have been prepared by treating the Cu electrode under constant potential in a mixed solution of Na2SO4 and Na2SeSO3, and the maximum contact angle was164° without performing surface modification.