Preparation And Properties Of Cu - Based Graphene Composites

Pure copper has good conductive and heat conductivity, but the strength is lower, it can’t meet the needs of the rapid development of modern industry. Enhanceosome is added in the pure copper Cu matrix composites, It is a effective way that without losing good properties of pure copper but increases its strength. The traditional microscopic composite copper alloy can improve the strength of copper alloy, but greatly reducing the conductivity of the copper alloy and heat conductivity. Although the carbon fiber reinforced copper matrix composites with high conductive thermal conductivity and wear resistance but it is poor mechanical properties. Carbon nanotubes is better than carbon fiber enhancement. However, the preparation of carbon nanotubes are difficult and the interface bonding state remains to be further improved. Graphene has high intensity (up to130Gpa), high electrical conductivity (carrier mobility is15000cm2/v),This paper choose the graphene as copper materials have high conductivity and strength to enhance system cornerstone of Cu composite material, to adapt to the requirements of modern industrialization.This article uses copper powder by electromagnetic oscillation deviced and planetary ball mill and graphene fine grinding and mixing, pressing after using the discharge plasma sintering process for the preparation of copper cornerstone ink composite materials. Cu cornerstone ink made of composite materials for the organization and mechanism analysis, and analyzes its mechanical and electrical conductivity test.After the ball mill, graphene and copper particle mixing, and transparent plate shaped distribution, size around5um. Composite materials are two kinds of organizations. The compound phase is a normal, namely graphene randomly scattered in copper matrix, the other is a particle groups, namely copper particles by graphene package of reunion. Mixed powder diffraction peak analysis shows that after the ball mill, copper get grain size and lattice distortion. The best ball grinding process parameters for:the ball material ratio of10:1, ball grinding time is8h, ball mill speed of200r/min.Through the study of the performance test of composite materials, found that the strength higher than that of pure copper, and the longer the ball mill, the organization is small, after the sintering performance of composite materials. In the other process parameters under the same conditions, Sample1#ball milled8h, sample2#milled4h, The tensile strength is higher than pure copper63Mpa, the latter is higher than36Mpa; Found in the tensile yield strength test, the former more than pure copper66Mpa, the latter more than54Mpa; The former compress yield strength than pure copper215Mpa, the latter more than185Mpa. Microhardness testing of the samples,It is found that, the former is higher than pure copper40Hv, the latter is higher than pure copper30HV. By Archimedes drainage method to test the density of composites, the study found that the density is lower than pure copper. Conductivity and lower than the normal pure copper but in the same order of magnitude, conductive percentage is about65%.The results showed that Adding graphene preparation of Cu in copper matrix cornerstone ink composite material can improve its mechanical properties, But the conductivity reduce not much, Conform to the requirements of the high conductivity and high strength material, It is good enhancement body, has high research values.