| Wireless sensor network is widely used in environment monitoring, military andother fields. However, the wireless sensor nodes mostly have the characteristics of largequantity and extensive distribution. As the energy of traditional battery is limited, powersupply is becoming a bottleneck problem for affecting further development for wirelesssensor network. As a result, recently the self-powered energy harvesting technologybecomes the main focus of researches as a replacement for battery. But a stand-aloneenergy harvesting technology is unable to supply enough power for sensor nodeseffectively. Then hybrid energy harvesting technology provides a solution. Most of thepresent researches about the power management of hybrid energy harvesting adopt thePCB and discrete components, which are no longer to meet the demands of low powerdissipation and small size. So the power management ASIC based-on CMOStechnology in this paper is the development trend in future.Firstly, the paper discussed the principle and characteristics of power managementfor the hybrid energy harvesting technology based-on piezoelectric energy harvestingand micro-light energy harvesting technology. And then the paper proposes a completeenergy harvesting solution. Secondly, a power management module for the piezoelectricenergy harvesting device is proposed that integrated with a low-loss AC/DC rectifierand a DC/DC converter. The key sub-modules including AC/DC converter, erroramplifier, band-gap voltage reference, PWM comparator and protection circuits arediscussed in detail. Thirdly, a high efficiency low dropout regulator (LDO) of themicro-light energy harvester is proposed. The paper also analyzed the stability of theLDO and presented a dynamic compensation mechanism to LDO, which is easier toachieve higher phase margin than traditional compensation strategy. The whole chip isdesigned using the SMIC0.35μm2P3M CMOS process.This paper discussed the power management ASIC of hybrid energy harvestingbased-on piezoelectric and micro-light energy harvesting technology. It includes AC/DCrectifier, DC/DC converter and LDO. The simulation results show that the performanceof the chip meets the requirements of design. |