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Dynamic Design And Optimization Of High Acceleration And High Precision Motion Platform

Posted on:2013-03-22Degree:MasterType:Thesis
Country:ChinaCandidate:L SongFull Text:PDF
GTID:2268330392469392Subject:Mechanical engineering
Abstract/Summary:PDF Full Text Request
Integrated circuit (IC) industry is one of the main motive in promotingnational economic development, while the IC package is a very important aspect ofthe IC industry. Faced with the miniaturization, integration, fine pitch, multi-leaddevelopment trends of the chip. The IC packaging industry gives a high demandson the positioning accuracy, the frequently reciprocating motion performance, thevelocity and acceleration, the settling time of the packaging equipment. Thissubject carries out a dynamic design and optimization of the XY platform used inthe IC packaging equipment combined with the major national science andtechnology projects.Against the contradictions of the high stiffness and the small quality of theXY platform, a XY platform which meet both the quality and vibrationcharacteristics is designed in this paper. It has a certain significance to furtherpromote the development of packaging equipment. On the basis of acomprehensive analysis of the research status of the XY platform, this paper givesa in-depth research and discussion on the structural design, the modal parameteridentification, the dynamic design and optimization of the XY platform.In the structural design, the structure of the parallel is selected. The XYplatform is drived by two linear motor. By the special structure of the linear motor,the coupling of the X and Y directions is decoupled. The preliminary designed XYplatform meet the basic design requirements, such as the travel, the overall sizeand guiding precision of the XY platform.In the modal parameter identification, the modal parameters of the cross rollerguide way which is the key factor to the dynamic performance of the XY stage isidentificated in this paper. Firstly, the experimental device is designed and it issimplified into a five degrees of freedom system. Secondly, The free vibrationdifferential equations are established using the Lagrangian method and thestiffness matrix and the damping matrix of the system are obtained. An order of therelatively high recognition accuracy modes is selected combined with the finiteelement analysis to carry out the identification experiment. Finally, the stiffnessand damping of the cross roller guide way is obtained.In the dynamic design and optimization, firstly, the topology optimizationbased on the maximum dynamic frequency is carried out to the preliminarydesigned XY platform. It minimizes the quality of the moving parts and ensures theoverall stiffness. Secondly, the modal analysis of the XY platform is carried out toget its inherent vibration characteristics. Then the transient dynamic analysis and steady state dynamic analysis are carried out to verify that the vibration responsecharacteristics in the load force to meet the design requirements. Finally, theimpact of the guide way on the tracking error of the XY platform is disscussed.After the design and analysis work, the XY platform is built and the test workis carried out. Firstly, we discuss how to ensure the accuracy of the assembly. Thenthe performance testing of the XY platform is carried out. It includes the basicperformance test, such as the movement straightness and the maximumacceleration of the XY platform. It also includes the inherent vibrationcharacteristics test, such as the natural frequencies and the mode shapes of the XYplatform. Finally, we verify the accuracy of the previous dynamic design and getthe vibration characteristics of the XY platform.
Keywords/Search Tags:IC packaging, XY platform, modal parameter identification, dynamicdesign, vibration characteristics
PDF Full Text Request
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