Development Of Performance Simulation Test Equipment Of Temperature Control Component

In the field of aerospace studies, the choice and test of martials cannot beignored. As the key parameters to measure material properties, thermal physicalparameters of materials have an important significant on the choice of aerospacematerials. Thermal conductivity and interface thermal resistance are both importantparameters of thermal physical test. So how to measure them accurately and reliablyhas been increased emphasis on scholars from every country. According to thedifferent test conditions and accuracy requirements, it has various kinds of testmethods. Although the non-steady state method has high testing speed, its accuracyis lower than the method of steady state method. However, method of steady-stateplate is the most popular and accurate method, and it has been widely used.This dissertation is based on a project, which is entrusted by AerospaceResearch Institute of Materials and Processing Technology. The project aims todesign a “performance simulation test equipment of temperature control component”.This equipment can analog the pressure conditions where the material works, inorder to measuring the inner temperature gradient of diverse materials at differenttemperature conditions. Meanwhile, calculate material’s thermophysical parametersof equivalent thermal conductivity and interface thermal resistance.After analyzing the technical specifications of the equipment and according tothe theory of steady-state plate method, this thesis gives the specific design of thesystem including hardware and software design. Then, the thesis gives a designproposal by using a multi-level modular design idea and writes the program of thesystem with LabVIEW.Finally, the system is carried out further debugging by means of test experimentat test sites, in order to makes the function more perfect. It has already reached thetechnical specifications of the equipment. At the same time, the advantages of thesystem include easy operation, well stability and high precision. It can measure theequivalent thermal conductivity and interface thermal resistance accurately.