Study On Preparation And Properties Of Epoxy Packaging Material

With the hard research in our country of epoxy potting these years has madesome progress. The epoxy potting can satisfy operating requirements of generalelectronic potting field. Compared with developed countries it has wide gaps inspaceflight. Nowadays, with the development of printing line technology,electronic components have change to miniaturization and thin, the requirementsof electronic potting performance become higher. Therefore, research somespecific materials to satisfy some using in specific conditions become thedevelopment trend of epoxy potting in later years.In this paper, the effection of type and dosage of additives on the epoxyencapsulation material performance were studied, and through the test results thatthe best conditions of encapsulation material curing was80℃/2h,90℃/2h,100℃/5h. The tensile shear strength of the package material decreased first and thenincrease with the decreasing of content of CTBN within a certain range, and thetensile shear strength came to18.151MPa（Aluminum unpolished） and28.903MPa（Aluminum polished） when the content of CTBN was10copies. The max Tgand mix mechanical loss of material were165℃and0.315respectively when thecontent of MNA was77copies. The three accelerators, aluminum acetylacetonate,DMP-30and BPO, can significantly improve the thermal stability of the systemwhen they common role in the system, and the final decomposition temperaturewas improved from450℃to600℃. In the same system, the dielectric loss andvolume resistivity were0.0031and3.202×10¹⁴·m respectively.In summary, the best formulation of the epoxy electronic packagingmaterials was that the contents of epoxy resin （E-44）, MNA, CTBN, aluminumacetylacetonate, DMP-30and BPO were100copies,77copies,10copies,1copies,1copies,2copies.