Preparation And Properties Of Heat Dissipation Powder Coatings Based On Carbon Material/Epoxy Resin Composites

With the development of modern technology, high-frequency and high speed of electronic devices, together with densification and miniaturization of integrated circuit, total power density and calorific value of unit volume electronics have been significantly increased. More and more attention made for cooling problem of electronic devices. The capacity of conventional cooling systems face great challenge, especially in areas such as power, automobile, air conditioner, agriculture, chemical engineering, micro-electronic, and information. It needs higher requirements for enhancement of heat dissipation efficiency. Heat dissipation coating is a special coating which can improve heat dissipation efficiency of the surface and decrease temperature of the system. Heat dissipation efficiency of electronic devices can be enhanced by coating the special heat dissipation coating on their surface.This dissertation mainly focuses on heat dissipation properties of carbon/epoxy resin powder coating by in situ polymerization. They are three parts as following:1. The composite coating based on multi-walled carbon nanotubes (MWNCTs) and epoxy resin was prepared by in situ polymerization between bisphenol A and epichlorohydrin in presence of MWNCTs as reinforcing and thermally conductive filler. Compared with epoxy resin, the thermal conductivity of MWNCTs/epoxy resin was improved after adding MWNCTs and it can reach to0.541W/m·K when the MWNCTs content at3%, other performance include deposited stability, impact resistance, adhesion, neutral salt spray corrosion also can be improved.2. The graphene was choosing to add into epoxy resin due to its extremly high thermal conductivity which is about5000W/m·K. The composite coating based on graphene and epoxy resin was prepared by in situ polymerization between bisphenol A and epichlorohydrin in presence of graphene as reinforcing and thermally conductive filler. Compared with MWNCTs/epoxy resin, the thermal conductivity of graphene/epoxy resin was improved after adding graphene and it is0.86W/m·K when the graphene content at1.5%, other performance include deposited stability, impact resistance, adhesion, neutral salt spray corrosion also were improved.3. MWNCTs and graphene were used as fillers to build3dimension thermal conductivity network. The composite coating based on graphene and epoxy resin was prepared in the same way which has been described above. When the content of graphene and MWCNTs are1.5%and0.5%, the thermal conductivity of graphene/MWCNTs/epoxy resin is2.26W/m·K which is higher than that of graphene/epoxy resin.